Inventor · disambiguated record

Shin-Yi Yang

Also filed as: YANG SHIN-YI

87 granted patents·51 pending applications·188 citations·filing 2012–2025

99Inventor score

Technology areasH10W H10P H01L B32B

Files withTAIWAN SEMICONDUCTOR MFG CO LTD132 TAIWAN SEMICONDUCTOR MFG5 TAIWAN TEXTILE RES INST1

Top patents by PatentIndex Score

138 records

0198US11854944B2Semiconductor packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·4 cites·9 claims
0298US11749643B2Semiconductor packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 5, 2023·4 cites·20 claims
0398US9972529B2Method of forming metal interconnectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 15, 2018·35 cites·20 claims
0498US9613856B1Method of forming metal interconnectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 4, 2017·38 cites·20 claims
0596US11929326B2Method of forming graphene barrier layer in interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 12, 2024·2 cites·20 claims
0695US11854987B2Semiconductor packages with interconnection features in a seal region and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·2 cites·20 claims
0795US11309241B2Protection liner on interconnect wire to enlarge processing window for overlying interconnect viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 19, 2022·3 cites·20 claims
0895US11205618B2Graphene barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 21, 2021·8 cites·20 claims
0995US10163786B2Method of forming metal interconnectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·11 cites·20 claims
1094US12094848B2Semiconductor packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 17, 2024·2 cites·20 claims
1194US11901349B2Semiconductor packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 13, 2024·2 cites·20 claims
1294US11682616B2Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 20, 2023·3 cites·20 claims
1393US10141260B1Interconnection structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 27, 2018·8 cites·20 claims
1491US11605558B2Integrated circuit interconnect structure having discontinuous barrier layer and air gapTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 14, 2023·2 cites·20 claims
1590US12300599B2Method for forming semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 13, 2025·1 cites·20 claims
1689US11094631B2Graphene layer for reduced contact resistanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 17, 2021·3 cites·20 claims
1789US11088020B2Structure and formation method of interconnection structure of semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 10, 2021·7 cites·20 claims
1888US9613854B2Method and apparatus for back end of line semiconductor device processingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 4, 2017·6 cites·20 claims
1988US9142505B2Method and apparatus for back end of line semiconductor device processingTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 22, 2015·9 cites·20 claims
2087US10510657B2Semiconductor device with interconnecting structure and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 17, 2019·3 cites·20 claims
2187US9318439B2Interconnect structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Apr 19, 2016·6 cites·20 claims
2286US10164018B1Semiconductor interconnect structure having graphene-capped metal interconnectsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·4 cites·20 claims
2385US11462470B2Method of forming graphene and metallic cap and barrier layers for interconnectsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 4, 2022·2 cites·20 claims
2484US12159814B2Semiconductor packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 3, 2024·0 cites·20 claims
2584US11830910B2Semiconductor structure having air gaps and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 28, 2023·1 cites·20 claims
2684US9818644B2Interconnect structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 14, 2017·3 cites·20 claims
2783US12272623B2Semiconductor packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 8, 2025·0 cites·20 claims
2883US11482451B2Interconnect structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 25, 2022·1 cites·20 claims
2983US11081447B2Graphene-assisted low-resistance interconnect structures and methods of formation thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 3, 2021·2 cites·20 claims
3083US9640431B2Method for via plating with seed layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 2, 2017·2 cites·20 claims
3183US9269668B2Interconnect having air gaps and polymer wrapped conductive linesTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 23, 2016·4 cites·20 claims
3283US2024379559A1Graphene-assisted low-resistance interconnect structures and methods of formation thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3382US12315811B2Graphene barrier layer for reduced contact resistanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 27, 2025·0 cites·20 claims
3482US12113021B2Graphene-assisted low-resistance interconnect structures and methods of formation thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 8, 2024·0 cites·20 claims
3582US9054163B2Method for via plating with seed layerTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 9, 2015·3 cites·20 claims
3682US2025226292A1Semiconductor packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
3781US2025364417A1Semiconductor device including graphene interconnect and method of making the semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
3881US2025300013A1Interconnect structures having varied materialsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
3980US12500173B2Interconnect structure with hybrid barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 16, 2025·0 cites·20 claims
4080US12211799B2Semiconductor packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 28, 2025·0 cites·20 claims
4180US12166026B2Semiconductor packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
4280US10535559B2Semiconductor interconnect structure having a graphene barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 14, 2020·2 cites·20 claims
4380US2024379527A1Integrated chip having a back-side power railTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
4480US2025293162A1Integrated chip with graphene based interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
4580US2023223334A1Interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
4679US12347776B2Integrated chip with graphene based interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 1, 2025·0 cites·20 claims
4779US12211788B2Hybrid interconnect structure for self aligned viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 28, 2025·0 cites·20 claims
4879US12142557B2Integrated chip having a back-side power railTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 12, 2024·0 cites·20 claims
4979US2025079426A1Semiconductor packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
5078US11978663B2Integrated circuit interconnect structure having discontinuous barrier layer and air gapTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 7, 2024·0 cites·20 claims

Showing the top 50 of 138 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →