Inventor · disambiguated record
Shing Yeh
Also filed as: YEH SHING · YEH SHING-CHIAO
15 granted patents·3 pending applications·914 citations·filing 1994–2018
95Inventor score
Top patents by PatentIndex Score
18 records- 0194US6281106B1Method of solder bumping a circuit componentDELPHI TECH INC·Filed 1999·Granted Aug 28, 2001·106 cites·21 claims
- 0294US6062461AProcess for bonding micromachined wafers using solderDELPHI TECH INC·Filed 1998·Granted May 16, 2000·196 cites·17 claims
- 0394US5803340AComposite solder paste for flip chip bumpingDELCO ELECTRONICS CORP·Filed 1995·Granted Sep 8, 1998·114 cites·17 claims
- 0494US5607099ASolder bump transfer device for flip chip integrated circuit devicesDELCO ELECTRONICS CORP·Filed 1995·Granted Mar 4, 1997·219 cites·6 claims
- 0587US6767411B2Lead-free solder alloy and solder reflow processDELPHI TECH INC·Filed 2002·Granted Jul 27, 2004·43 cites·43 claims
- 0686US7726972B1Liquid metal rotary connector apparatus for a vehicle steering wheel and columnDELPHI TECH INC·Filed 2009·Granted Jun 1, 2010·17 cites·2 claims
- 0781US6251501B1Surface mount circuit device and solder bumping method thereforDELPHI TECH INC·Filed 1999·Granted Jun 26, 2001·66 cites·20 claims
- 0877US6630251B1Leach-resistant solder alloys for silver-based thick-film conductorsDELPHI TECH INC·Filed 2002·Granted Oct 7, 2003·21 cites·31 claims
- 0976US5938862AFatigue-resistant lead-free alloyDELCO ELECTRONICS CORP·Filed 1998·Granted Aug 17, 1999·39 cites·11 claims
- 1076US5491364AReduced stress terminal pattern for integrated circuit devices and packagesDELCO ELECTRONICS CORP·Filed 1994·Granted Feb 13, 1996·54 cites·17 claims
- 1173US6811892B2Lead-based solder alloys containing copperDELPHI TECH INC·Filed 2002·Granted Nov 2, 2004·19 cites·20 claims
- 1273US6570260B1Solder process and solder alloy thereforDELPHI TECH INC·Filed 2002·Granted May 27, 2003·13 cites·17 claims
- 1365US7447041B2Compression connection for vertical IC packagesDELPHI TECH INC·Filed 2007·Granted Nov 4, 2008·3 cites·7 claims
- 1461US10600206B2Tracking system and method thereofHTC CORP·Filed 2018·Granted Mar 24, 2020·1 cites·18 claims
- 1551US6619536B2Solder process and solder alloy thereforDELPHI TECH INC·Filed 2003·Granted Sep 16, 2003·3 cites·14 claims
- 1641US2012168208A1System and method of forming a mechanical support for an electronic component attached to a circuit boardSOZANSKY WAYNE A·Filed 2010·Application pending·0 cites
- 1741US2008012099A1Electronic assembly and manufacturing method having a reduced need for wire bondsYEH SHING·Filed 2006·Application pending·0 cites
- 1839US2006255476A1Electronic assembly with controlled solder joint thicknessKUHLMAN FREDERICK F·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →