Inventor · disambiguated record
Shu-Tang Yeh
Also filed as: YEH SHU-TANG
19 granted patents·3 pending applications·89 citations·filing 2005–2024
92Inventor score
Top patents by PatentIndex Score
22 records- 0192US8093512B2Package of environmentally sensitive electronic device and fabricating method thereofCHEN KUANG-JUNG·Filed 2009·Granted Jan 10, 2012·28 cites·25 claims
- 0287US9935289B2Environmental sensitive element package and encapsulation method thereofIND TECH RES INST·Filed 2016·Granted Apr 3, 2018·3 cites·14 claims
- 0387US8236126B2Encapsulation method of environmentally sensitive electronic elementCHEN KUANG-JUNG·Filed 2010·Granted Aug 7, 2012·11 cites·13 claims
- 0483US7445857B2Organometallic complex and organic electroluminescent devices utilizing the sameIND TECH RES INST·Filed 2005·Granted Nov 4, 2008·15 cites·15 claims
- 0580US8222810B2Substrate, fabrication method thereof and a display using the sameYAN JING-YI·Filed 2009·Granted Jul 17, 2012·5 cites·9 claims
- 0680US7438980B2Organometallic complex and organic electroluminescent devices utilizing the sameIND TECH RES INST·Filed 2005·Granted Oct 21, 2008·4 cites·26 claims
- 0779US9041280B2Double-side light emitting display panelIND TECH RES INST·Filed 2013·Granted May 26, 2015·5 cites·7 claims
- 0878US9142798B2Package of environmental sensitive electronic elementCHEN KUANG-JUNG·Filed 2012·Granted Sep 22, 2015·4 cites·23 claims
- 0978US8366505B2Apparatus of organic light emitting diode and packaging method of the sameIND TECH RES INST·Filed 2009·Granted Feb 5, 2013·6 cites·45 claims
- 1076US8878226B2Light emitting deviceIND TECH RES INST·Filed 2013·Granted Nov 4, 2014·3 cites·21 claims
- 1174US8446730B2Package of environmental sensitive elementCHEN KUANG-JUNG·Filed 2010·Granted May 21, 2013·3 cites·27 claims
- 1270US8763243B2Fabrication method of substrateYAN JING-YI·Filed 2012·Granted Jul 1, 2014·1 cites·6 claims
- 1365US9510459B2Environmental sensitive electronic device package and manufacturing method thereofIND TECH RES INST·Filed 2013·Granted Nov 29, 2016·1 cites·34 claims
- 1459US2025212654A1Encapsulation structureIND TECH RES INST·Filed 2024·Application pending·0 cites
- 1558US11551829B2Electronic deviceIND TECH RES INST·Filed 2021·Granted Jan 10, 2023·0 cites·20 claims
- 1654US11825570B2Heater packageIND TECH RES INST·Filed 2019·Granted Nov 21, 2023·0 cites·20 claims
- 1754US2014198435A1Package structure of electronic deviceIND TECH RES INST·Filed 2013·Application pending·0 cites
- 1852US10985297B2Package of photoelectric deviceIND TECH RES INST·Filed 2019·Granted Apr 20, 2021·0 cites·12 claims
- 1952US8368088B2Light-emitting device and method manufacturing the sameIND TECH RES INST·Filed 2010·Granted Feb 5, 2013·0 cites·25 claims
- 2050US9795028B2Package structure of electronic deviceIND TECH RES INST·Filed 2016·Granted Oct 17, 2017·0 cites·13 claims
- 2143US2021202333A1Encapsulation structureIND TECH RES INST·Filed 2020·Application pending·0 cites
- 2242US9847512B2Electronic device package structure and manufacturing method thereofIND TECH RES INST·Filed 2013·Granted Dec 19, 2017·0 cites·30 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →