Inventor · disambiguated record
Shun Tik Yeung
Also filed as: YEUNG SHUN TIK
10 granted patents·8 pending applications·26 citations·filing 2015–2024
83Inventor score
Top patents by PatentIndex Score
18 records- 0189US9391007B1Built-up lead frame QFN and DFN packages and method of making thereofNXP BV·Filed 2015·Granted Jul 12, 2016·10 cites·10 claims
- 0286US10410941B2Wafer level semiconductor device with wettable flanksNexperia BV·Filed 2016·Granted Sep 10, 2019·6 cites·18 claims
- 0386US9640463B2Built-up lead frame package and method of making thereofNexperia BV·Filed 2015·Granted May 2, 2017·7 cites·7 claims
- 0471US10304759B2Electronic device and method of making sameNexperia BV·Filed 2016·Granted May 28, 2019·2 cites·4 claims
- 0562US2025105206A1Method of and intermediate for manufacturing a semiconductor die packageNexperia BV·Filed 2024·Application pending·0 cites
- 0662US2025183128A1Lead FrameNexperia BV·Filed 2024·Application pending·0 cites
- 0761US10262926B2Reversible semiconductor dieNexperia BV·Filed 2016·Granted Apr 16, 2019·1 cites·13 claims
- 0858US2024332144A1Method for manufacturing a semiconductor package assembly as well as a semiconductor package assembly obtained with this methodNexperia BV·Filed 2024·Application pending·0 cites
- 0954US2025006576A1Method of manufacturing semiconductor assembliesNexperia BV·Filed 2024·Application pending·0 cites
- 1053US2025112135A1Semiconductor packageNexperia BV·Filed 2024·Application pending·0 cites
- 1150US2024006276A1Method of manufacturing semiconductor package assembly and a semiconductor package assembly manufactured using this methodNexperia BV·Filed 2023·Application pending·0 cites
- 1249US2023134075A1Semiconductor package and method for producing the sameNexperia BV·Filed 2022·Application pending·0 cites
- 1347US10658274B2Electronic deviceNexperia BV·Filed 2018·Granted May 19, 2020·0 cites·14 claims
- 1439US11094562B2Semiconductor device and method of manufactureNexperia BV·Filed 2018·Granted Aug 17, 2021·0 cites·12 claims
- 1537US9947632B2Semiconductor device and method of making a semiconductor deviceNexperia BV·Filed 2016·Granted Apr 17, 2018·0 cites·15 claims
- 1634US10256168B2Semiconductor device and lead frame thereforNexperia BV·Filed 2016·Granted Apr 9, 2019·0 cites·19 claims
- 1734US2017170103A1Electronic device and manufacturing method thereforNexperia BV·Filed 2016·Application pending·0 cites
- 1833US10529644B2Semiconductor deviceNexperia BV·Filed 2016·Granted Jan 7, 2020·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →