Inventor · disambiguated record
Shu-Ming Yip
Also filed as: YIP SHU-MING
1 granted patent·2 pending applications·0 citations·filing 2016–2024
6Inventor score
Technology areasH10W
Files withNexperia BV3
Top patents by PatentIndex Score
3 records- 0154US2025006576A1Method of manufacturing semiconductor assembliesNexperia BV·Filed 2024·Application pending·0 cites
- 0250US2024006276A1Method of manufacturing semiconductor package assembly and a semiconductor package assembly manufactured using this methodNexperia BV·Filed 2023·Application pending·0 cites
- 0334US10256168B2Semiconductor device and lead frame thereforNexperia BV·Filed 2016·Granted Apr 9, 2019·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →