Inventor · disambiguated record
Shusuke Yoshihara
Also filed as: YOSHIHARA SHUSUKE
11 granted patents·7 pending applications·11 citations·filing 2009–2022
81Inventor score
Top patents by PatentIndex Score
18 records- 0187US8921507B2Thermoplastic resin with high thermal conductivityYOSHIHARA SHUSUKE·Filed 2011·Granted Dec 30, 2014·7 cites·13 claims
- 0275US10253178B2Flowability improver for polycarbonate and polyarylate, polycarbonate resin composition, polyarylate resin composition, and molded article thereofKANEKA CORP·Filed 2017·Granted Apr 9, 2019·1 cites·19 claims
- 0373US8946335B2Highly thermally conductive thermoplastic resin composition and thermoplastic resinYOSHIHARA SHUSUKE·Filed 2009·Granted Feb 3, 2015·2 cites·23 claims
- 0470US8617503B2Process for production of spheroidized boron nitrideYOSHIHARA SHUSUKE·Filed 2010·Granted Dec 31, 2013·1 cites·5 claims
- 0565US9234095B2Thermally-conductive organic additive, resin composition, and cured productKANEKA CORP·Filed 2014·Granted Jan 12, 2016·0 cites·18 claims
- 0663US2025019538A1Biodegradable polymer composition with processing aidKANEKA AMERICAS HOLDING INC·Filed 2022·Application pending·0 cites
- 0761US11889623B2Metal-clad laminate, printed circuit board, and method of manufacturing sameKANEKA CORP·Filed 2021·Granted Jan 30, 2024·0 cites·12 claims
- 0854US11629237B2Solvent composition and production method thereforKANEKA CORP·Filed 2019·Granted Apr 18, 2023·0 cites·14 claims
- 0953US2023062748A1Modifiers for polyesters that improve viscosity in meltKANEKA AMERICAS HOLDING INC·Filed 2021·Application pending·0 cites
- 1051US2018298186A1Resin composition, semi-cured thermally conductive film using same, circuit board and adhesive sheetKANEKA CORP·Filed 2018·Application pending·0 cites
- 1149US2012175549A1Thermally-conductive organic additive, resin composition, and cured productYOSHIHARA SHUSUKE·Filed 2010·Application pending·0 cites
- 1248US2015014603A1Thermally conductive resin compact and method for manufacturing thermally conductive resin compactKANEKA CORP·Filed 2013·Application pending·0 cites
- 1345US9809735B2Highly-thermally-conductive resin composition, and resin material for heat dissipation/heat transfer and thermally conductive film comprising sameKANEKA CORP·Filed 2014·Granted Nov 7, 2017·0 cites·10 claims
- 1445US9200111B2Thermoplastic resin, resin composition, and molding of high thermal conductivityNAKAMURA MITSURU·Filed 2012·Granted Dec 1, 2015·0 cites·13 claims
- 1544US8637630B2Thermoplastic resin with high thermal conductivityYOSHIHARA SHUSUKE·Filed 2011·Granted Jan 28, 2014·0 cites·10 claims
- 1638US10619004B2Flowability enhancing agent for polycarbonate resin, method for producing said agent, polycarbonate resin composition and molded article thereofKANEKA CORP·Filed 2017·Granted Apr 14, 2020·0 cites·18 claims
- 1736US2019119490A1Resin composition, moulded article, and plated moulded articleKANEKA CORP·Filed 2017·Application pending·0 cites
- 1836US2020040180A1Polycarbonate resin composition and molded article thereofKANEKA CORP·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →