Inventor · disambiguated record
Shinji Yoshihara
Also filed as: YOSHIHARA SHINJI
33 granted patents·15 pending applications·1,873 citations·filing 1987–2025
98Inventor score
Top patents by PatentIndex Score
48 records- 0197US6555901B1Semiconductor device including eutectic bonding portion and method for manufacturing the sameDENSO CORP·Filed 1997·Granted Apr 29, 2003·380 cites·7 claims
- 0295US6450029B1Capacitive physical quantity detection deviceDENSO CORP·Filed 2000·Granted Sep 17, 2002·61 cites·8 claims
- 0395US6429506B1Semiconductor device produced by dicingDENSO CORP·Filed 2000·Granted Aug 6, 2002·82 cites·1 claims
- 0494US5824177AMethod for manufacturing a semiconductor deviceNIPPON DENSO CO·Filed 1996·Granted Oct 20, 1998·184 cites·17 claims
- 0594US5668033AMethod for manufacturing a semiconductor acceleration sensor deviceNIPPON DENSO CO·Filed 1996·Granted Sep 16, 1997·301 cites·20 claims
- 0694US4975390AMethod of fabricating a semiconductor pressure sensorNIPPON DENSO CO·Filed 1987·Granted Dec 4, 1990·125 cites·14 claims
- 0793US6287885B1Method for manufacturing semiconductor dynamic quantity sensorDENSO CORP·Filed 1999·Granted Sep 11, 2001·84 cites·38 claims
- 0892US6255741B1Semiconductor device with a protective sheet to affix a semiconductor chipDENSO CORP·Filed 1999·Granted Jul 3, 2001·150 cites·36 claims
- 0990US6277756B1Method for manufacturing semiconductor deviceDENSO CORP·Filed 2000·Granted Aug 21, 2001·64 cites·10 claims
- 1090US6245593B1Semiconductor device with flat protective adhesive sheet and method of manufacturing the sameDENSO CORP·Filed 1999·Granted Jun 12, 2001·99 cites·23 claims
- 1189US6245984B1Apparatus and method for composing music data by inputting time positions of notes and then establishing pitches of notesYAMAHA CORP·Filed 1999·Granted Jun 12, 2001·95 cites·34 claims
- 1285US6313529B1Bump bonding and sealing a semiconductor device with solderDENSO CORP·Filed 1998·Granted Nov 6, 2001·78 cites·20 claims
- 1383US6059902AAluminum alloy of excellent machinability and manufacturing method thereofKOBE STEEL LTD·Filed 1997·Granted May 9, 2000·35 cites·11 claims
- 1478US8876993B2Method for manufacturing an extruded material of heat treatment type Al—Zn—Mg series aluminum alloyMIYATA YUKIMASA·Filed 2012·Granted Nov 4, 2014·3 cites·3 claims
- 1575US9206496B2Aluminum alloy extruded material for electro-magnetic formingKOBE STEEL LTD·Filed 2013·Granted Dec 8, 2015·1 cites·13 claims
- 1673US9551054B27xxx series aluminum alloy member excellent in stress corrosion cracking resistance and method for manufacturing the sameKOBE STEEL LTD·Filed 2014·Granted Jan 24, 2017·1 cites·7 claims
- 1771US10487383B2Method for producing 7000-series aluminum alloy member excellent in stress corrosion cracking resistanceKOBE STEEL LTD·Filed 2018·Granted Nov 26, 2019·0 cites·2 claims
- 1871US6747329B2Semiconductor sensor chip having diaphragm and method of manufacturing the sameDENSO CORP·Filed 2001·Granted Jun 8, 2004·15 cites·4 claims
- 1968US5835778APreinitialized load module modifying systemNEC CORP·Filed 1996·Granted Nov 10, 1998·55 cites·15 claims
- 2067US7091109B2Semiconductor device and method for producing the same by dicingDENSO CORP·Filed 2004·Granted Aug 15, 2006·9 cites·11 claims
- 2167US6658948B2Semiconductor dynamic quantity sensorDENSO CORP·Filed 2002·Granted Dec 9, 2003·13 cites·14 claims
- 2266US9657374B2Free-machining aluminum alloy extruded material with reduced surface roughness and excellent productivityKOBE STEEL LTD·Filed 2014·Granted May 23, 2017·0 cites·13 claims
- 2366US6858451B2Method for manufacturing a dynamic quantity detection deviceDENSO CORP·Filed 2003·Granted Feb 22, 2005·13 cites·10 claims
- 2465US12252765B2Automotive door beam made of aluminum alloy extruded materialKOBE STEEL LTD·Filed 2020·Granted Mar 18, 2025·0 cites·4 claims
- 2565US7174072B2Optical device having optical waveguide and method for manufacturing the sameDENSO CORP·Filed 2005·Granted Feb 6, 2007·3 cites·27 claims
- 2663US6787929B2Semiconductor device having a flat protective adhesive sheetDENSO CORP·Filed 2001·Granted Sep 7, 2004·7 cites·11 claims
- 2763US2025276566A1Automobile door beam and method for manufacturing sameKOBE STEEL LTD·Filed 2023·Application pending·0 cites
- 2863US2025179617A1Automotive door beam made of aluminum alloy extruded materialKOBE STEEL LTD·Filed 2025·Application pending·0 cites
- 2961US2016333445A1Free-machining aluminum alloy extruded material with reduced surface roughness and excellent productivityKK KOBE SIKO SHO (KOBE STEEL LTD )·Filed 2016·Application pending·0 cites
- 3059US2019078180A1Free-machining aluminum alloy extruded material with reduced surface roughness and excellent productivityKOBE STEEL LTD·Filed 2018·Application pending·0 cites
- 3159US2016237540A1Method for producing 7000-series aluminum alloy member excellent in stress corrosion cracking resistanceKOBE STEEL LTD·Filed 2015·Application pending·0 cites
- 3259US2024287654A1Aluminum alloy extruded material and method for manufacturing the sameKOBE STEEL LTD·Filed 2022·Application pending·0 cites
- 3358US2009242087A1Extruded member of aluminum alloy excelling in flexural crushing performance and corrosion resistance and method for production thereofKOBE STEEL LTD·Filed 2009·Application pending·0 cites
- 3457US2024158898A1High-strength aluminum alloy extruded material and manufacturing method thereforKOBE STEEL LTD·Filed 2022·Application pending·0 cites
- 3556US8610246B2Semiconductor device capable of restricting coil extension direction and manufacturing method thereofYOSHIHARA SHINJI·Filed 2011·Granted Dec 17, 2013·1 cites·4 claims
- 3653US2011247736A1Extruded member of aluminum alloy excelling in flexural crushing performance and corrosion resistance and method for production thereofKOBE STEEL LTD·Filed 2011·Application pending·0 cites
- 3752US2003207143A1Shock absorbing materialKOBE STEEL LTD·Filed 2003·Application pending·0 cites
- 3848US6995466B2Semiconductor device having passivation cap and method for manufacturing the sameDENSO CORP·Filed 2003·Granted Feb 7, 2006·1 cites·20 claims
- 3947US6960487B2Method for manufacturing a dynamic quantity detection deviceDENSO CORP·Filed 2003·Granted Nov 1, 2005·2 cites·12 claims
- 4047US2003041925A1Al-Mg-Si based aluminum alloy extrusionKOBE STEEL LTD·Filed 2002·Application pending·0 cites
- 4145US2003008165A1Shock absorbing materialKABUSHI KAISHA KOBE SEIKO SHO·Filed 2002·Application pending·0 cites
- 4243US10697047B2High strength aluminum alloy extruded material excellent in stress corrosion cracking resistanceMIYATA YUKIMASA·Filed 2011·Granted Jun 30, 2020·0 cites·16 claims
- 4339US2005079716A1Semiconductor optical device and method for manufacturing the sameDENSO CORP·Filed 2004·Application pending·0 cites
- 4436US6938501B2Semiconductor dynamic quantity sensorDENSO CORP·Filed 2003·Granted Sep 6, 2005·0 cites·10 claims
- 4535US2001007960A1Network system for composing music by collaboration of terminalsYAMAHA CORP·Filed 2001·Application pending·0 cites
- 4634US6421786B1Virtual system time management system utilizing a time storage area and time converting mechanismNEC CORP·Filed 1999·Granted Jul 16, 2002·6 cites·15 claims
- 4734US5684995ASegment division management systemNEC CORP·Filed 1994·Granted Nov 4, 1997·5 cites·8 claims
- 4830US2002014287A1A1-mg-si based aluminum alloy extrusionFiled 1999·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →