Inventor · disambiguated record
Shingo Yoshioka
Also filed as: YOSHIOKA SHINGO
42 granted patents·2 pending applications·163 citations·filing 1990–2018
97Inventor score
Top patents by PatentIndex Score
44 records- 0196US9468092B2Electrically conductive filmPANASONIC IP MAN CO LTD·Filed 2014·Granted Oct 11, 2016·14 cites·13 claims
- 0295US8482137B2Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the sameYOSHIOKA SHINGO·Filed 2010·Granted Jul 9, 2013·22 cites·21 claims
- 0393US9802397B2Structural member for electronic devicesPANASONIC IP MAN CO LTD·Filed 2015·Granted Oct 31, 2017·6 cites·14 claims
- 0492US10009994B2Resin composition and film using samePANASONIC IP MAN CO LTD·Filed 2014·Granted Jun 26, 2018·5 cites·6 claims
- 0590US10966317B2Sheet-shaped stretchable structure, and resin composition for stretchable resin sheet and stretchable resin sheet used for the structurePANASONIC IP MAN CO LTD·Filed 2018·Granted Mar 30, 2021·5 cites·12 claims
- 0690US8240036B2Method of producing a circuit boardYOSHIOKA SHINGO·Filed 2008·Granted Aug 14, 2012·19 cites·16 claims
- 0788US8929092B2Circuit board, and semiconductor device having component mounted on circuit boardYOSHIOKA SHINGO·Filed 2010·Granted Jan 6, 2015·10 cites·5 claims
- 0885US9332650B2Method of producing multilayer circuit boardYOSHIOKA SHINGO·Filed 2012·Granted May 3, 2016·7 cites·10 claims
- 0985US9070393B2Three-dimensional structure in which wiring is provided on its surfacePANASONIC CORP·Filed 2014·Granted Jun 30, 2015·6 cites·2 claims
- 1084US10371612B2Prepreg, metal-clad laminated plate, wiring board, and method for measuring thermal stress of wiring board materialPANASONIC IP MAN CO LTD·Filed 2016·Granted Aug 6, 2019·2 cites·11 claims
- 1182US7161878B2Recording apparatus for an optical diskSONY CORP·Filed 2005·Granted Jan 9, 2007·4 cites·6 claims
- 1279US9351402B2Circuit board, and semiconductor device having component mounted on circuit boardPANASONIC CORP·Filed 2014·Granted May 24, 2016·4 cites·2 claims
- 1376US8272126B2Method of producing circuit boardYOSHIOKA SHINGO·Filed 2009·Granted Sep 25, 2012·6 cites·12 claims
- 1474US9082438B2Three-dimensional structure for wiring formationPANASONIC CORP·Filed 2014·Granted Jul 14, 2015·2 cites·1 claims
- 1571US9839119B2Electrically conductive filmPANASONIC IP MAN CO LTD·Filed 2014·Granted Dec 5, 2017·0 cites·11 claims
- 1671US8698003B2Method of producing circuit board, and circuit board obtained using the manufacturing methodYOSHIOKA SHINGO·Filed 2009·Granted Apr 15, 2014·4 cites·20 claims
- 1769US10791624B2Resin composition and film using samePANASONIC IP MAN CO LTD·Filed 2018·Granted Sep 29, 2020·0 cites·9 claims
- 1867US8759148B2Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the samePANASONIC CORP·Filed 2013·Granted Jun 24, 2014·1 cites·13 claims
- 1967US7035969B2Recording medium having recording program recorded thereinPIONEER CORP·Filed 2003·Granted Apr 25, 2006·6 cites·30 claims
- 2065US7233736B2Recording method and apparatus, and recording mediumPIONEER CORP·Filed 2003·Granted Jun 19, 2007·5 cites·5 claims
- 2164US7043620B2Recording medium having recording program recorded therein and recording apparatus and methodPIONEER CORP·Filed 2003·Granted May 9, 2006·5 cites·29 claims
- 2263US10109390B2Conductive film, and touch panel, display, touch sensor, and solar cell using the samePANASONIC IP MAN CO LTD·Filed 2017·Granted Oct 23, 2018·0 cites·14 claims
- 2361US9082635B2Wiring method, structure having wiring provided on surface, semiconductor device, wiring board, memory card, electric device, module and multilayer circuit boardYOSHIOKA SHINGO·Filed 2011·Granted Jul 14, 2015·1 cites·9 claims
- 2460US9736935B2Resin composition, resin varnish, prepreg, metal-clad laminated board and printed wiring boardPANASONIC CORP·Filed 2014·Granted Aug 15, 2017·0 cites·9 claims
- 2560US9175151B2Resin composition and method for producing circuit boardPANASONIC CORP·Filed 2014·Granted Nov 3, 2015·0 cites·1 claims
- 2660US9082825B2Manufacturing method for semiconductor package, semiconductor package, and semiconductor devicePANASONIC CORP·Filed 2012·Granted Jul 14, 2015·1 cites·19 claims
- 2759US7057984B2Recorder apparatus, method, and processing program for recording data from a position continuously succeeding a recorded areaSONY CORP·Filed 2002·Granted Jun 6, 2006·3 cites·9 claims
- 2856US9795033B2Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the samePANASONIC CORP·Filed 2013·Granted Oct 17, 2017·0 cites·5 claims
- 2956US8901728B2Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the samePANASONIC CORP·Filed 2013·Granted Dec 2, 2014·0 cites·4 claims
- 3055US10299379B2Sheet-shaped stretchable structure, and resin composition for stretchable resin sheet and stretchable resin sheet used for the structurePANASONIC IP MAN CO LTD·Filed 2015·Granted May 21, 2019·0 cites·26 claims
- 3155US8032011B2Recording medium having recording program recorded therein and recording apparatus and methodSONY CORP·Filed 2003·Granted Oct 4, 2011·2 cites·22 claims
- 3254US9585248B2Resin composition, resin varnish, prepreg, metal-clad laminated board and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2016·Granted Feb 28, 2017·0 cites·12 claims
- 3352US9568673B2Dry film for optical waveguides, optical waveguide using same, photoelectric composite wiring board using same, and method for producing photoelectric composite wiring boardPANASONIC IP MAN CO LTD·Filed 2013·Granted Feb 14, 2017·0 cites·11 claims
- 3450US5279895APolyimide composition and prepreg and laminate thereofMATSUSHITA ELECTRIC WORKS LTD·Filed 1992·Granted Jan 18, 1994·10 cites·6 claims
- 3549US9332642B2Circuit boardPANASONIC CORP·Filed 2014·Granted May 3, 2016·0 cites·3 claims
- 3649US5160781APolyimide composition and prepreg and laminate thereofMATSUSHITA ELECTRIC WORKS LTD·Filed 1990·Granted Nov 3, 1992·12 cites·8 claims
- 3748US2012292083A1Method of producing circuit board by additive method, and circuit board and multilayer circuit board obtained by the methodYOSHIOKA SHINGO·Filed 2012·Application pending·0 cites
- 3847US8877843B2Resin composition and method for producing circuit boardKONNO YUKO·Filed 2011·Granted Nov 4, 2014·0 cites·13 claims
- 3947US8433183B2Recording device and recording methodHIDAKA YASUHIRO·Filed 2003·Granted Apr 30, 2013·1 cites·8 claims
- 4045US9669567B2Manufacturing method of molded articlePANASONIC CORP·Filed 2014·Granted Jun 6, 2017·0 cites·5 claims
- 4145US9204530B2Electronic components assemblyPANASONIC CORP·Filed 2013·Granted Dec 1, 2015·0 cites·7 claims
- 4243US2015271924A1Wiring method, structure having wiring provided on surface, semiconductor device, wiring board, memory card, electric device, module, and multilayer circuit boardPANASONIC CORP·Filed 2015·Application pending·0 cites
- 4341US7469094B2Medium recording method, medium recording device, and information recording mediumSONY CORP·Filed 2003·Granted Dec 23, 2008·0 cites·11 claims
- 4437US9480148B2Metal-clad laminate and printed wiring boardINOUE HIROHARU·Filed 2012·Granted Oct 25, 2016·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →