Inventor · disambiguated record
Shinji Yuri
Also filed as: YURI SHINJI
18 granted patents·5 pending applications·354 citations·filing 2003–2024
95Inventor score
Top patents by PatentIndex Score
23 records- 0196US7808799B2Wiring boardNGK SPARK PLUG CO·Filed 2007·Granted Oct 5, 2010·73 cites·23 claims
- 0294US7889509B2Ceramic capacitorNGK SPARK PLUG CO·Filed 2006·Granted Feb 15, 2011·31 cites·10 claims
- 0394US7696442B2Wiring board and manufacturing method of wiring boardNGK SPARK PLUG CO·Filed 2006·Granted Apr 13, 2010·40 cites·8 claims
- 0494US7525814B2Wiring board and method for manufacturing the sameNGK SPARK PLUG CO·Filed 2006·Granted Apr 28, 2009·38 cites·16 claims
- 0594US7345246B2Wiring board and capacitor to be built into wiring boardNGK SPARK PLUG CO·Filed 2006·Granted Mar 18, 2008·34 cites·20 claims
- 0692US8183465B2Component built-in wiring substrate and manufacturing method thereofSUZUKI SHINYA·Filed 2009·Granted May 22, 2012·35 cites·20 claims
- 0792US7932471B2Capacitor for incorporation in wiring board, wiring board, method of manufacturing wiring board, and ceramic chip for embedmentNGK SPARK PLUG CO·Filed 2006·Granted Apr 26, 2011·22 cites·44 claims
- 0890US7557440B2Wiring board and ceramic chip to be embeddedNGK SPARK PLUG CO·Filed 2006·Granted Jul 7, 2009·19 cites·20 claims
- 0984US7742314B2Wiring board and capacitorNGK SPARK PLUG CO·Filed 2006·Granted Jun 22, 2010·17 cites·17 claims
- 1079US7473988B2Wiring board construction including embedded ceramic capacitors(s)NGK SPARK PLUG CO·Filed 2006·Granted Jan 6, 2009·10 cites·11 claims
- 1179US6976415B2Method for manufacturing printed wiring substrates, metal plate for use in manufacturing printed wiring substrates, and multi-printed wiring-substrate panelNGK SPARK PLUG CO·Filed 2005·Granted Dec 20, 2005·7 cites·11 claims
- 1275US7704548B2Method for manufacturing wiring boardNGK SPARK PLUG CO·Filed 2007·Granted Apr 27, 2010·6 cites·12 claims
- 1372US8546700B2Capacitor for incorporation in wiring board, wiring board, method of manufacturing wiring board, and ceramic chip for embedmentYAMAMOTO HIROSHI·Filed 2011·Granted Oct 1, 2013·2 cites·13 claims
- 1472US7973245B2Wiring board and capacitor to be built into wiring boardNGK SPARK PLUG CO·Filed 2008·Granted Jul 5, 2011·4 cites·5 claims
- 1568US7115435B2Manufacturing method for wiring substratesNGK SPARK PLUG CO·Filed 2005·Granted Oct 3, 2006·4 cites·6 claims
- 1666US7956454B2Wiring board and ceramic chip to be embeddedNGK SPARK PLUG CO·Filed 2009·Granted Jun 7, 2011·2 cites·17 claims
- 1764US6872436B2Method for manufacturing printed wiring substrates, metal plate for use in manufacturing printed wiring substrates, and multi-printed wiring-substrate panelNGK SPARK PLUG CO·Filed 2003·Granted Mar 29, 2005·9 cites·6 claims
- 1857US8863378B2Method for manufacturing a wiring boardMURAMATSU MASAKI·Filed 2010·Granted Oct 21, 2014·1 cites·3 claims
- 1954US2025046641A1Sintered alumina material and electrostatic chuckNITERRA CO LTD·Filed 2024·Application pending·0 cites
- 2050US2010163172A1Method for manufacturing wiring board with built-in componentNGK SPARK PLUG CO·Filed 2009·Application pending·0 cites
- 2144US2010163168A1Method for manufacturing wiring board with built-in componentSAITA KENICHI·Filed 2009·Application pending·0 cites
- 2239US2008289866A1Wiring Board and Wiring Board Manufacturing MethodNGK SPARK PLUG CO·Filed 2005·Application pending·0 cites
- 2339US2004238209A1Multilayer wiring board, method of manufacturing the wiring board and substrate material for the wiring boardNGK SPARK PLUG CO·Filed 2003·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Shinji Yuri files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →