Inventor · disambiguated record
Shiyou Zhao
Also filed as: ZHAO SHIYOU
9 granted patents·2 pending applications·47 citations·filing 2005–2015
87Inventor score
Top patents by PatentIndex Score
11 records- 0189US8516695B2Method for forming a circuit board via structure for high speed signalingZHAO SHIYOU·Filed 2011·Granted Aug 27, 2013·11 cites·11 claims
- 0289US7676919B2Method for forming a circuit board via structure for high speed signalingMICRON TECHNOLOGY INC·Filed 2006·Granted Mar 16, 2010·13 cites·8 claims
- 0386US7992297B2Method for forming a circuit board via structure for high speed signalingMICRON TECHNOLOGY INC·Filed 2010·Granted Aug 9, 2011·5 cites·8 claims
- 0477US7778039B2Substrates, systems, and devices including structures for suppressing power and ground plane noise, and methods for suppressing power and ground plane noiseMICRON TECHNOLOGY INC·Filed 2006·Granted Aug 17, 2010·9 cites·39 claims
- 0576US7459638B2Absorbing boundary for a multi-layer circuit board structureMICRON TECHNOLOGY INC·Filed 2005·Granted Dec 2, 2008·7 cites·18 claims
- 0667US8743555B2Methods for suppressing power plane noiseMICRON TECHNOLOGY INC·Filed 2013·Granted Jun 3, 2014·1 cites·20 claims
- 0760US9055702B2Method for forming a circuit board via structure for high speed signalingMICRON TECHNOLOGY INC·Filed 2013·Granted Jun 9, 2015·0 cites·13 claims
- 0855US9622358B2Method for forming a circuit board via structure for high speed signalingMICRON TECHNOLOGY INC·Filed 2015·Granted Apr 11, 2017·0 cites·10 claims
- 0952US8508950B2Substrates, systems, and devices including structures for suppressing power and ground plane noise, and methods for suppressing power and ground plane noiseCHEN HOUFEI·Filed 2010·Granted Aug 13, 2013·1 cites·28 claims
- 1046US2006237227A1Circuit board via structure for high speed signalingZHAO SHIYOU·Filed 2005·Application pending·0 cites
- 1144US2007193775A1Impedance matching via structure for high-speed printed circuit boards and method of determining sameMICRON TECHNOLOGY INC·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →