Inventor · disambiguated record
Sidney Larry Anderson
Also filed as: ANDERSON SIDNEY LARRY
3 granted patents·1 pending application·90 citations·filing 2000–2002
73Inventor score
Files withALTERA CORP3
Top patents by PatentIndex Score
4 records- 0187US6462414B1Integrated circuit package utilizing a conductive structure for interlocking a conductive ball to a ball padALTERA CORP·Filed 2000·Granted Oct 8, 2002·72 cites·43 claims
- 0267US6929978B2Method of fabricating an integrated circuit package utilizing a conductive structure for improving the bond strength between an IC package and a printed circuit boardALTERA CORP·Filed 2002·Granted Aug 16, 2005·16 cites·30 claims
- 0344US6627517B1Semiconductor package with improved thermal cycling performance, and method of forming sameALTERA CORP·Filed 2000·Granted Sep 30, 2003·2 cites·20 claims
- 0435US2002145207A1Method and structure for integrated circuit packageFiled 2000·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →