Inventor · disambiguated record
Siping Bai
Also filed as: BAI SIPING
7 granted patents·4 citations·filing 2016–2022
76Inventor score
Files withRICHVIEW ELECTRONICS CO LTD7
Top patents by PatentIndex Score
7 records- 0187US10321581B2Single-layer circuit board, multi-layer circuit board, and manufacturing methods thereforRICHVIEW ELECTRONICS CO LTD·Filed 2016·Granted Jun 11, 2019·4 cites·4 claims
- 0274US11917768B2Single-layer circuit board, multi-layer circuit board, and manufacturing methods thereforRICHVIEW ELECTRONICS CO LTD·Filed 2022·Granted Feb 27, 2024·0 cites·3 claims
- 0369US11266027B2Single-layer circuit board, multi-layer circuit board, and manufacturing methods thereforRICHVIEW ELECTRONICS CO LTD·Filed 2020·Granted Mar 1, 2022·0 cites·4 claims
- 0469US11032915B2Single-layer circuit board, multi-layer circuit board, and manufacturing methods thereforRICHVIEW ELECTRONICS CO LTD·Filed 2020·Granted Jun 8, 2021·0 cites·4 claims
- 0563US10757820B2Single-layer circuit board, multi-layer circuit board, and manufacturing methods thereforRICHVIEW ELECTRONICS CO LTD·Filed 2019·Granted Aug 25, 2020·0 cites·3 claims
- 0662US10757821B2Single-layer circuit board, multi-layer circuit board, and manufacturing methods thereforRICHVIEW ELECTRONICS CO LTD·Filed 2019·Granted Aug 25, 2020·0 cites·3 claims
- 0746US11552617B2Microwave dielectric component and manufacturing method thereofRICHVIEW ELECTRONICS CO LTD·Filed 2018·Granted Jan 10, 2023·0 cites·42 claims
Join the waitlist — get patent alerts
Get an alert when Siping Bai files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →