Inventor · disambiguated record
Siddhartha Bhowmik
Also filed as: BHOWMIK SIDDHARTHA
21 granted patents·6 pending applications·228 citations·filing 1998–2019
94Inventor score
Files withAGERE SYST GUARDIAN CORP4AGERE SYSTEMS INC4BHOWMIK SIDDHARTHA3BIOTRONIK SE & CO KG3HEWLETT PACKARD DEVELOPMENT CO3
Top patents by PatentIndex Score
27 records- 0193US6720261B1Method and system for eliminating extrusions in semiconductor viasAGERE SYSTEMS INC·Filed 2000·Granted Apr 13, 2004·91 cites·16 claims
- 0284US6930055B1Substrates having features formed therein and methods of formingHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Aug 16, 2005·31 cites·27 claims
- 0380US8714710B2Print headRIVAS RIO·Filed 2010·Granted May 6, 2014·3 cites·16 claims
- 0476US8573740B2Manufacture of a print headRIVAS RIO·Filed 2010·Granted Nov 5, 2013·3 cites·15 claims
- 0574US11298555B2Feedthrough connectors in glassBIOTRONIK SE & CO KG·Filed 2019·Granted Apr 12, 2022·2 cites·11 claims
- 0674US8585180B2Protective coating for print head feed slotsBHOWMIK SIDDHARTHA·Filed 2009·Granted Nov 19, 2013·5 cites·14 claims
- 0773US6331484B1Titanium-tantalum barrier layer film and method for forming the sameLUCENT TECHNOLOGIES INC·Filed 2000·Granted Dec 18, 2001·20 cites·41 claims
- 0869US8333459B2Printing deviceRIVAS RIO·Filed 2008·Granted Dec 18, 2012·3 cites·20 claims
- 0966US8262204B2Print head die slot ribsBRAUN DAVID M·Filed 2007·Granted Sep 11, 2012·8 cites·22 claims
- 1061US6455418B1Barrier for copper metallizationAGERE SYST GUARDIAN CORP·Filed 2000·Granted Sep 24, 2002·8 cites·6 claims
- 1158US6288449B1Barrier for copper metallizationAGERE SYST GUARDIAN CORP·Filed 1998·Granted Sep 11, 2001·19 cites·5 claims
- 1254US8240828B2Fluid ejection cartridge and methodSHARAN ALOK·Filed 2008·Granted Aug 14, 2012·1 cites·20 claims
- 1352US11211200B2Inductive communication coil designBIOTRONIK SE & CO KG·Filed 2018·Granted Dec 28, 2021·0 cites·19 claims
- 1452US7691746B2Formation of silicon nitride layer on back side of substrateHEWLETT PACKARD DEVELOPMENT CO·Filed 2007·Granted Apr 6, 2010·1 cites·5 claims
- 1552US6323078B1Method of forming metal oxide metal capacitors using multi-step rapid thermal process and a device formed therebyAGERE SYST GUARDIAN CORP·Filed 1999·Granted Nov 27, 2001·11 cites·15 claims
- 1650US7071563B2Barrier layer for interconnect structures of a semiconductor wafer and method for depositing the barrier layerAGERE SYSTEMS INC·Filed 2001·Granted Jul 4, 2006·3 cites·9 claims
- 1748US6169036B1Method for cleaning via openings in integrated circuit manufacturingLUCENT TECHNOLOGIES INC·Filed 1999·Granted Jan 2, 2001·16 cites·32 claims
- 1847US6699372B2Method of coil preparation for ionized metal plasma process and method of manufacturing integrated circuitsAGERE SYST GUARDIAN CORP·Filed 2001·Granted Mar 2, 2004·1 cites·29 claims
- 1946US6495875B2Method of forming metal oxide metal capacitors using multi-step rapid material thermal process and a device formed therebyAGERE SYSTEMS INC·Filed 2001·Granted Dec 17, 2002·2 cites·6 claims
- 2044US8888252B2Print head slot ribsBHOWMIK SIDDHARTHA·Filed 2008·Granted Nov 18, 2014·0 cites·20 claims
- 2144US2009020511A1AblationKOMMERA SWAROOP K·Filed 2007·Application pending·0 cites
- 2243US7855151B2Formation of a slot in a silicon substrateHEWLETT PACKARD DEVELOPMENT CO·Filed 2007·Granted Dec 21, 2010·0 cites·12 claims
- 2343US2016197056A1Die and Manufacturing Method for a DieBIOTRONIK SE & CO KG·Filed 2014·Application pending·0 cites
- 2438US2004013386A1Optical device and method of manufacture thereofAGERE SYSTEMS INC·Filed 2002·Application pending·0 cites
- 2538US2004106279A1Method and system for eliminating extrusions in semiconductor viasFiled 2003·Application pending·0 cites
- 2632US2003091870A1Method of forming a liner for tungsten plugsFiled 2001·Application pending·0 cites
- 2729US2013256260A1Method of forming substrate for fluid ejection deviceBHOWMIK SIDDHARTHA·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →