Inventor · disambiguated record
Simon Bubel
Also filed as: BUBEL SIMON
10 granted patents·8 pending applications·69 citations·filing 2019–2025
88Inventor score
Top patents by PatentIndex Score
18 records- 0196US12070875B2Silicon carbide wafers with relaxed positive bow and related methodsWOLFSPEED INC·Filed 2023·Granted Aug 27, 2024·5 cites·18 claims
- 0296US11654596B2Silicon carbide wafers with relaxed positive bow and related methodsWOLFSPEED INC·Filed 2021·Granted May 23, 2023·10 cites·24 claims
- 0396US11034056B2Silicon carbide wafers with relaxed positive bow and related methodsCREE INC·Filed 2020·Granted Jun 15, 2021·7 cites·31 claims
- 0496US10611052B1Silicon carbide wafers with relaxed positive bow and related methodsCREE INC·Filed 2019·Granted Apr 7, 2020·39 cites·30 claims
- 0594US12054850B2Large diameter silicon carbide wafersWOLFSPEED INC·Filed 2020·Granted Aug 6, 2024·5 cites·33 claims
- 0689US2024367348A1Silicon Carbide Wafers with Relaxed Positive Bow and Related MethodsWOLFSPEED INC·Filed 2024·Application pending·0 cites
- 0787US12125701B2Large dimension silicon carbide single crystalline materials with reduced crystallographic stressWOLFSPEED INC·Filed 2020·Granted Oct 22, 2024·2 cites·10 claims
- 0885US12473661B2Large diameter silicon carbide wafersWOLFSPEED INC·Filed 2024·Granted Nov 18, 2025·0 cites·20 claims
- 0985US12024794B2Reduced optical absorption for silicon carbide crystalline materialsWOLFSPEED INC·Filed 2021·Granted Jul 2, 2024·1 cites·19 claims
- 1077US2024344239A1Reduced optical absorption for silicon carbide crystalline materialsWOLFSPEED INC·Filed 2024·Application pending·0 cites
- 1176US12362237B1Fill-in planarization system and methodWOLFSPEED INC·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 1273US2025336723A1Fill-In Planarization System and MethodWOLFSPEED INC·Filed 2025·Application pending·0 cites
- 1371US2025006491A1Large dimension silicon carbide single crystalline materials with reduced crystallographic stressWOLFSPEED INC·Filed 2024·Application pending·0 cites
- 1466US12438001B1Off axis laser-based surface processing operations for semiconductor wafersWOLFSPEED INC·Filed 2024·Granted Oct 7, 2025·0 cites·20 claims
- 1555US2025353136A1Polishing Pad Assembly for Electrochemical Mechanical PolishingWOLFSPEED INC·Filed 2024·Application pending·0 cites
- 1651US2025357131A1Ionic Slurry for Electrochemical Mechanical PolishingWOLFSPEED INC·Filed 2024·Application pending·0 cites
- 1749US2025357182A1Workpiece Surface Processing System for Semiconductor WafersWOLFSPEED INC·Filed 2024·Application pending·0 cites
- 1848US2025282021A1Disc Grinding for Semiconductor Wafers on Polishing SystemWOLFSPEED INC·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →