Inventor · disambiguated record
Sidney J. Clouser
Also filed as: CLOUSER SIDNEY · CLOUSER SIDNEY J
20 granted patents·1 pending application·460 citations·filing 1989–2008
96Inventor score
Files withGOULD INC6GOULD ELECTRONICS INC5GA TEK INC3NIKKO MATERIALS USA INC3ELECTROCOPPER PROD LTD1
Top patents by PatentIndex Score
21 records- 0184US6805964B2Protective coatings for improved tarnish resistance in metal foilsNIKKO MATERIALS USA INC·Filed 2003·Granted Oct 19, 2004·22 cites·23 claims
- 0283US5863666AHigh performance flexible laminateGOULD ELECTRONICS INC·Filed 1997·Granted Jan 26, 1999·46 cites·26 claims
- 0382US5017271AMethod for printed circuit board pattern making using selectively etchable metal layersGOULD INC·Filed 1990·Granted May 21, 1991·55 cites·30 claims
- 0481US5243320AResistive metal layers and method for making sameGOULD INC·Filed 1991·Granted Sep 7, 1993·65 cites·27 claims
- 0577US6447929B1Thin copper on usable carrier and method of forming sameGOULD ELECTRONICS INC·Filed 2000·Granted Sep 10, 2002·23 cites·22 claims
- 0677US5215645AElectrodeposited foil with controlled properties for printed circuit board applications and procedures and electrolyte bath solutions for preparing the sameGOULD INC·Filed 1989·Granted Jun 1, 1993·35 cites·31 claims
- 0770US6770976B2Process for manufacturing copper foil on a metal carrier substrateNIKKO MATERIALS USA INC·Filed 2002·Granted Aug 3, 2004·6 cites·29 claims
- 0869US6824880B1Process for improving adhesion of resistive foil to laminating materialsGA TEK INC·Filed 2003·Granted Nov 30, 2004·17 cites·40 claims
- 0967US6132887AHigh fatigue ductility electrodeposited copper foilGOULD ELECTRONICS INC·Filed 1996·Granted Oct 17, 2000·28 cites·25 claims
- 1067US5421985AElectrodeposited copper foil and process for making same using electrolyte solutions having low chloride ion concentrationsGOULD INC·Filed 1992·Granted Jun 6, 1995·26 cites·27 claims
- 1166US6771160B2Resistor component with multiple layers of resistive materialNIKKO MATERIALS USA INC·Filed 2001·Granted Aug 3, 2004·10 cites·6 claims
- 1264US6622374B1Resistor component with multiple layers of resistive materialGOULD ELECTRONICS INC·Filed 2000·Granted Sep 23, 2003·9 cites·12 claims
- 1364US5403465AElectrodeposited copper foil and process for making same using electrolyte solutions having controlled additions of chloride ions and organic additivesGOULD INC·Filed 1993·Granted Apr 4, 1995·30 cites·29 claims
- 1463US5366612AProcess for making copper foilMAGMA COPPER CO·Filed 1993·Granted Nov 22, 1994·14 cites·23 claims
- 1562US6537675B1Protective coatings for improved tarnish resistance in metal foilsGA TEK INC·Filed 2000·Granted Mar 25, 2003·6 cites·27 claims
- 1662US5171417ACopper foils for printed circuit board applications and procedures and electrolyte bath solutions for electrodepositing the sameGOULD INC·Filed 1990·Granted Dec 15, 1992·25 cites·14 claims
- 1761US5454926AElectrodeposited copper foilGOULD ELECTRONICS INC·Filed 1994·Granted Oct 3, 1995·19 cites·18 claims
- 1858US2009090634A1Method of plating metal onto titaniumSIFCO SELECTIVE PLATING·Filed 2008·Application pending·0 cites
- 1949US5830583ACopper wireFiled 1997·Granted Nov 3, 1998·16 cites·8 claims
- 2043US6123788ACopper wire and process for making copper wireELECTROCOPPER PROD LTD·Filed 1996·Granted Sep 26, 2000·7 cites·21 claims
- 2128US6183607B1Anode structure for manufacture of metallic foilGA TEK INC·Filed 1999·Granted Feb 6, 2001·1 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →