Inventor · disambiguated record
Simon Dong
Also filed as: DONG SIMON
3 granted patents·1 pending application·2 citations·filing 2021–2024
49Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0188US11942459B2Semiconductor device package with exposed bond wiresWESTERN DIGITAL TECH INC·Filed 2022·Granted Mar 26, 2024·2 cites·20 claims
- 0252US12062625B2Semiconductor device package mold flow control system and methodWESTERN DIGITAL TECH INC·Filed 2021·Granted Aug 13, 2024·0 cites·19 claims
- 0350US2025309018A1Encapsulated semiconductor packages including multifunctional interface material (mim) structuresSANDISK TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 0448US12482761B2Semiconductor device package having improved conductive stub coverageSANDISK TECHNOLOGIES INC·Filed 2021·Granted Nov 25, 2025·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →