Inventor · disambiguated record

Si Ping Hu

Also filed as: HU SI PING

26 granted patents·2 pending applications·68 citations·filing 2018–2024

95Inventor score

Technology areasH10W H10P H01L

Files withYANGTZE MEMORY TECH CO LTD28

Top patents by PatentIndex Score

28 records

0194US10580788B2Methods for forming three-dimensional memory devicesYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Mar 3, 2020·14 cites·20 claims
0292US10680003B2Staircase structure for memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Jun 9, 2020·6 cites·12 claims
0392US10672711B2Word line contact structure for three-dimensional memory devices and fabrication methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Jun 2, 2020·7 cites·19 claims
0491US11276642B2Method for forming three-dimensional integrated wiring structure and semiconductor structure thereofYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Mar 15, 2022·2 cites·19 claims
0591US10763158B2Method for forming lead wires in hybrid-bonded semiconductor devicesYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Sep 1, 2020·6 cites·15 claims
0691US10679941B2Method for forming three-dimensional integrated wiring structure and semiconductor structure thereofYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Jun 9, 2020·6 cites·12 claims
0790US11322392B2Method for forming lead wires in hybrid-bonded semiconductor devicesYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted May 3, 2022·2 cites·5 claims
0890US10748851B1Hybrid bonding using dummy bonding contacts and dummy interconnectsYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Aug 18, 2020·6 cites·20 claims
0989US11462503B2Hybrid bonding using dummy bonding contactsYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Oct 4, 2022·2 cites·10 claims
1089US11289422B2Bonding alignment marks at bonding in interfaceYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Mar 29, 2022·6 cites·14 claims
1188US11205619B2Hybrid bonding using dummy bonding contacts and dummy interconnectsYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Dec 21, 2021·2 cites·9 claims
1286US2025031366A1Staircase structure for memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
1384US11177231B2Bonding contacts having capping layer and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Nov 16, 2021·4 cites·17 claims
1483US11145666B2Staircase structure for memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Oct 12, 2021·1 cites·20 claims
1582US11049834B2Hybrid bonding using dummy bonding contactsYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Jun 29, 2021·3 cites·20 claims
1681US12137558B2Staircase structure for memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Nov 5, 2024·0 cites·20 claims
1780US10796993B2Method for forming three-dimensional integrated wiring structure and semiconductor structure thereofYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Oct 6, 2020·1 cites·20 claims
1876US12010838B2Staircase structure for memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Jun 11, 2024·0 cites·20 claims
1975US11996322B2Method for forming lead wires in hybrid-bonded semiconductor devicesYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted May 28, 2024·0 cites·20 claims
2075US11670543B2Method for forming lead wires in hybrid-bonded semiconductor devicesYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Jun 6, 2023·0 cites·16 claims
2172US11791265B2Method for forming three-dimensional integrated wiring structure and semiconductor structure thereofYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Oct 17, 2023·0 cites·20 claims
2270US2023317665A1Bonding contacts having capping layer and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
2366US11876049B2Bonding alignment marks at bonding interfaceYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jan 16, 2024·0 cites·16 claims
2466US11715718B2Bonding contacts having capping layer and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Aug 1, 2023·0 cites·20 claims
2563US11101276B2Word line contact structure for three-dimensional memory devices and fabrication methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Aug 24, 2021·0 cites·18 claims
2662US11056387B2Method for forming three-dimensional integrated wiring structure and semiconductor structure thereofYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jul 6, 2021·0 cites·20 claims
2755US10651087B2Method for forming three-dimensional integrated wiring structure and semiconductor structure thereofYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted May 12, 2020·0 cites·10 claims
2846US10607887B2Method for forming three-dimensional integrated wiring structure and semiconductor structure thereofYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Mar 31, 2020·0 cites·20 claims

Join the waitlist — get patent alerts

Get an alert when Si Ping Hu files or is granted a new patent.

We store only your email — no account needed. See our privacy policy.

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →