Inventor · disambiguated record
Siping Hu
Also filed as: HU SIPING
15 granted patents·11 pending applications·11 citations·filing 2011–2024
86Inventor score
Files withYANGTZE MEMORY TECH CO LTD22WUHAN XINXIN SEMICONDUCTOR MFG2LAO XUEJUN1ZHEJIANG MED XINCHANG PHARM1
Top patents by PatentIndex Score
26 records- 0193US11450653B2Bonded three-dimensional memory devices having bonding layersYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Sep 20, 2022·4 cites·20 claims
- 0292US11495569B2Metal-dielectric bonding method and structureYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Nov 8, 2022·3 cites·20 claims
- 0388US11233041B2Bonded three-dimensional memory devices and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jan 25, 2022·3 cites·20 claims
- 0475US11978719B2Metal-dielectric bonding method and structureYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted May 7, 2024·0 cites·20 claims
- 0574US11037945B2Bonded three-dimensional memory devices and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jun 15, 2021·1 cites·20 claims
- 0674US2025008735A1Contact pads of three-dimensional memory device and fabrication method thereofYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 0771US11798913B2Metal-dielectric bonding method and structureYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Oct 24, 2023·0 cites·19 claims
- 0871US2025015015A1Three-dimensional memory devices and fabricating methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 0968US2023005873A1Semiconductor structure and method of forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2022·Application pending·0 cites
- 1066US12136599B2Three-dimensional memory devices and fabricating methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Nov 5, 2024·0 cites·18 claims
- 1164US2021398932A1Semiconductor structure and method of forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Application pending·0 cites
- 1263US12507406B23D memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Dec 23, 2025·0 cites·20 claims
- 1361US12133386B2Contact pads of three-dimensional memory device and fabrication method thereofYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Oct 29, 2024·0 cites·19 claims
- 1460US12080697B2Method for forming a three-dimensional (3D) memory device having bonded semiconductor structuresYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Sep 3, 2024·0 cites·20 claims
- 1558US2021335745A1Semiconductor structure and method of forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Application pending·0 cites
- 1657US2023422528A1Three-dimensional memory devices and manufacturing methods thereof and three-dimensional memoriesYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 1753US2020006275A1Semiconductor structure and method of forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2019·Application pending·0 cites
- 1852US11842911B2Wafer stress control using backside film deposition and laser annealYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Dec 12, 2023·0 cites·20 claims
- 1952US2020006284A1Semiconductor structure and method of forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2019·Application pending·0 cites
- 2051US12089406B2Three-dimensional memory device comprising contact pads exposed by an opening passing through layer stack and fabrication method thereofYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Sep 10, 2024·0 cites·16 claims
- 2149US2023065535A1Three-dimensional integration structure and method of forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Application pending·0 cites
- 2249US2023062030A1Semiconductor device with seal ringYANGTZE MEMORY TECH CO LTD·Filed 2021·Application pending·0 cites
- 2347US11013807B2Stable fat-soluble active ingredient composition, microcapsule and process of preparation and use thereofZHEJIANG MED XINCHANG PHARM·Filed 2018·Granted May 25, 2021·0 cites·6 claims
- 2444US8697919B21-methoxyl-2, 6, 10-trimethyl-1, 3, 5, 9-undec-tetraene, and preparation method and uses thereofLAO XUEJUN·Filed 2011·Granted Apr 15, 2014·0 cites·13 claims
- 2539US9455297B2Preparation process of image sensorsWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2015·Granted Sep 27, 2016·0 cites·9 claims
- 2627US2016093661A1Image sensor having an embedded color filter and its preparation methodWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →