Inventor · disambiguated record
Sin-Yao Huang
Also filed as: HUANG SIN-YAO
23 granted patents·4 pending applications·91 citations·filing 2015–2025
94Inventor score
Top patents by PatentIndex Score
27 records- 0198US11694979B2Isolation structure for bond pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 4, 2023·4 cites·20 claims
- 0298US11069736B2Via support structure under pad areas for BSI bondability improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 20, 2021·6 cites·20 claims
- 0398US9704827B2Hybrid bond pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 11, 2017·32 cites·20 claims
- 0496US10991667B2Isolation structure for bond pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 27, 2021·9 cites·20 claims
- 0596US10038025B2Via support structure under pad areas for BSI bondability improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 31, 2018·11 cites·20 claims
- 0694US10566374B2Via support structure under pad areas for BSI bondability improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 18, 2020·7 cites·20 claims
- 0793US10283549B2Via support structure under pad areas for BSI bondability improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 7, 2019·6 cites·20 claims
- 0893US10038026B2Bond pad structure for bonding improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 31, 2018·7 cites·20 claims
- 0993US2025357399A1Isolation structure for bond pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1087US12424577B2Isolation structure for bond pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 23, 2025·0 cites·20 claims
- 1187US11804473B2Hybrid bond pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 31, 2023·1 cites·20 claims
- 1285US11335716B2Photosensing pixel, image sensor and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 17, 2022·2 cites·7 claims
- 1384US12300670B2Hybrid bond pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 13, 2025·0 cites·20 claims
- 1484US2024162269A1Bond pad structure for bonding improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1583US12400984B2Isolation structure for bond pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 26, 2025·0 cites·20 claims
- 1683US10475758B2Semiconductor device structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 12, 2019·3 cites·20 claims
- 1782US10269770B2Hybrid bond pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·2 cites·20 claims
- 1882US2025318290A1Stilted pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1979US2024379716A1Stilted pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2077US11894410B2Bond pad structure for bonding improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 6, 2024·0 cites·20 claims
- 2177US11244981B2Bond pad structure for bonding improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 8, 2022·1 cites·20 claims
- 2270US12396272B2Stilted pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 19, 2025·0 cites·20 claims
- 2363US11024602B2Hybrid bond pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 1, 2021·0 cites·20 claims
- 2462US11282802B2Semiconductor device structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 22, 2022·0 cites·20 claims
- 2561US10515995B2Bond pad structure for bonding improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 24, 2019·0 cites·20 claims
- 2652US9881884B2Semiconductor device structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 30, 2018·0 cites·20 claims
- 2738US11457094B2Network system and conversion apparatus crossing different transmission protocolsQNAP SYSTEMS INC·Filed 2020·Granted Sep 27, 2022·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →