Inventor · disambiguated record

Sixin Ji

Also filed as: JI SIXIN

2 granted patents·4 pending applications·0 citations·filing 2020–2025

31Inventor score

Technology areasH10W

Files withSEMICONDUCTOR COMPONENTS IND LLC6

Top patents by PatentIndex Score

6 records

0179US2025336759A1Module with substrate recess for conductive-bonding componentSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
0276US12354930B2Module with substrate recess for conductive-bonding componentSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Jul 8, 2025·0 cites·16 claims
0365US11776871B2Module with substrate recess for conductive-bonding componentSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Oct 3, 2023·0 cites·19 claims
0457US2025329627A1Semiconductor device package and methods of manufactureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
0552US2025015044A1Die-substrate interface including locking featuresSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
0651US2025157893A1Discrete semiconductor device package with lead frame clipSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →