Inventor · disambiguated record
Singda Jiang
Also filed as: JIANG SINGDA
0 granted patents·4 pending applications·0 citations·filing 2024–2025
Technology areasH10W
Files withTAIWAN SEMICONDUCTOR MFG CO LTD4
Top patents by PatentIndex Score
4 records- 0172US2025336755A1Semiconductor package with double-sided thermal solution and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0268US2025201651A1Semiconductor package with double-sided thermal solution and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0359US2025246517A1Multi-zone impingement cooling of semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0457US2025343096A1Semiconductor device packages and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →