Inventor · disambiguated record
Si Yun Kim
Also filed as: KIM SI YUN
8 granted patents·3 pending applications·17 citations·filing 2012–2023
77Inventor score
Top patents by PatentIndex Score
11 records- 0183US8661617B1Hooking structure of vehicle doorHYUNDAI MOTOR CO LTD·Filed 2012·Granted Mar 4, 2014·12 cites·4 claims
- 0274US10184245B2Earthquake-resistant light tower with the tuned mass damperCHUNIL CO LTD·Filed 2017·Granted Jan 22, 2019·3 cites·4 claims
- 0361US10442276B2Door curtain mounting structure for vehicleHYUNDAI MOTOR CO LTD·Filed 2018·Granted Oct 15, 2019·2 cites·14 claims
- 0457US12237251B2Semiconductor package including connection pad including groove patternSK HYNIX INC·Filed 2022·Granted Feb 25, 2025·0 cites·19 claims
- 0555US12002783B2Methods of manufacturing semiconductor device with bump interconnectionSK HYNIX INC·Filed 2021·Granted Jun 4, 2024·0 cites·20 claims
- 0653US2024162176A1Semiconductor package including bump interconnection structureSK HYNIX INC·Filed 2023·Application pending·0 cites
- 0752US12288761B2Semiconductor device including re-distribution pads disposed at different levels and a method of manufacturing the sameSK HYNIX INC·Filed 2022·Granted Apr 29, 2025·0 cites·20 claims
- 0851US12451467B2Semiconductor device having a redistribution bonding interconnection, a method of manufacturing the semiconductor device, and a chip stack package including the semiconductor deviceSK HYNIX INC·Filed 2022·Granted Oct 21, 2025·0 cites·11 claims
- 0948US2023154879A1Semiconductor device, a package substrate, and a semiconductor packageSK HYNIX INC·Filed 2022·Application pending·0 cites
- 1047US2023056222A1Semiconductor packagesSK HYNIX INC·Filed 2022·Application pending·0 cites
- 1138US10300770B2Door beam for vehicleHYUNDAI MOTOR CO LTD·Filed 2017·Granted May 28, 2019·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →