Inventor · disambiguated record
Siegfried Kopannia
Also filed as: KOPANNIA SIEGFRIED
11 granted patents·6 pending applications·320 citations·filing 1993–2018
91Inventor score
Top patents by PatentIndex Score
17 records- 0194US5512625AThermoplastic hotmelt adhesiveHENKEL KGAA·Filed 1993·Granted Apr 30, 1996·126 cites·19 claims
- 0286US5548027AHotmelt adhesiveHENKEL KGAA·Filed 1993·Granted Aug 20, 1996·49 cites·24 claims
- 0384US10590310B2Electrical debonding of PU hot melt adhesives by use of conductive inksHENKEL AG & CO KGAA·Filed 2018·Granted Mar 17, 2020·1 cites·16 claims
- 0480US6803400B1Water-swellable hot-melt-type adhesiveHENKEL KGAA·Filed 1999·Granted Oct 12, 2004·45 cites·26 claims
- 0575US6767424B1Hot-melt adhesive for glueing DVDsHENKEL KGAA·Filed 1999·Granted Jul 27, 2004·37 cites·19 claims
- 0673US8969440B2Composite material containing natural fibersHENKEL AG & CO KGAA·Filed 2013·Granted Mar 3, 2015·2 cites·14 claims
- 0769US6677394B1Swellable hotmelt adhesiveHENKEL KGAA·Filed 1997·Granted Jan 13, 2004·37 cites·56 claims
- 0858US2014374032A1Electrically divisible polyamide adhesiveHENKEL AG & CO KGAA·Filed 2014·Application pending·0 cites
- 0957US9487686B2Reactive two-component hotmelt adhesive compositionHENKEL AG & CO KGAA·Filed 2014·Granted Nov 8, 2016·0 cites·19 claims
- 1055US2009291288A1Molded parts from hot melt adhesivesHENKEL AG & CO KGAA·Filed 2009·Application pending·0 cites
- 1154US2008196831A1Method of adhesively bonding a first component to a second componentFRIESE CARSTEN·Filed 2008·Application pending·0 cites
- 1249US5883172APolyamide hotmelt adhesiveHENKEL KGAA·Filed 1997·Granted Mar 16, 1999·16 cites·20 claims
- 1345US2017158909A1Polyamide Hot Melt CoatingHENKEL AG & CO KGAA·Filed 2017·Application pending·0 cites
- 1443US10689551B2Thermally conductive adhesiveHENKEL AG & CO KGAA·Filed 2017·Granted Jun 23, 2020·0 cites·11 claims
- 1540US2011297318A1Metal-to-polymer bonding using an adhesive based on epoxidesBARRIAU EMILIE·Filed 2011·Application pending·0 cites
- 1637US2012175817A1Hydrolytically stable polyamideBECKER BETTINA·Filed 2012·Application pending·0 cites
- 1733US6228456B1Hot-melt adhesive for gluing digital versatile discsHENKEL KGAA·Filed 1998·Granted May 8, 2001·7 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →