Inventor · disambiguated record
Siegfried Kopnick
Also filed as: KOEPNICK SIEGFRIED · KOPNICK SIEGFRIED
5 granted patents·144 citations·filing 1979–1994
83Inventor score
Top patents by PatentIndex Score
5 records- 0186US5378858ATwo-layer or multilayer printed circuit boardPHILIPS CORP·Filed 1992·Granted Jan 3, 1995·58 cites·14 claims
- 0285US4317856AInsulating-material bodies having metal particles dispersed in the resinDYNAMIT NOBEL AG·Filed 1979·Granted Mar 2, 1982·44 cites·5 claims
- 0361US5525181AMethod of manufacturing a multilayer printed circuit board having first and second conducting patterns connected through an adhesive layer and laminate for the manufacture of such a printed circuit boardPHILIPS CORP·Filed 1994·Granted Jun 11, 1996·20 cites·13 claims
- 0443US5560795AProcess for manufacturing a printed circuit board and printed circuit boardPHILIPS ELECTRONICS NV·Filed 1992·Granted Oct 1, 1996·13 cites·20 claims
- 0541US4360560ABase material for the production of printed circuits and process for the preparation of the base materialDYNAMIT NOBEL AG·Filed 1979·Granted Nov 23, 1982·9 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →