Inventor · disambiguated record
Siyi Lai
Also filed as: LAI SIYI
1 granted patent·2 pending applications·17 citations·filing 2002–2024
38Inventor score
Top patents by PatentIndex Score
3 records- 0174US7122093B1Gas-assisted resin injection technique for bonding and surface modification in micro-fluidic devicesUNIV OHIO STATE·Filed 2003·Granted Oct 17, 2006·17 cites·36 claims
- 0259US2025283000A1Systems and processes for fluidized catalytic cracking (fcc)T EN PROCESS TECH INC·Filed 2024·Application pending·0 cites
- 0331US2003186405A1Micro/nano-embossing process and useful applications thereofUNIV OHIO STATE RES FOUND·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →