Inventor · disambiguated record
Sizhe Li
Also filed as: LI SIZHE
11 granted patents·10 pending applications·11 citations·filing 2018–2025
84Inventor score
Files withYANGTZE MEMORY TECH CO LTD21
Top patents by PatentIndex Score
21 records- 0191US10868031B2Multiple-stack three-dimensional memory device and fabrication method thereofYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Dec 15, 2020·5 cites·6 claims
- 0284US2025280538A1Multiple-stack three-dimensional memory device and fabrication method thereofYANGTZE MEMORY TECH CO LTD·Filed 2025·Application pending·0 cites
- 0382US10825929B2Structures and methods for reducing stress in three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Nov 3, 2020·3 cites·22 claims
- 0475US10910390B2Memory device and forming method thereofYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Feb 2, 2021·1 cites·20 claims
- 0572US11968832B2Multiple-stack three-dimensional memory device and fabrication method thereofYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Apr 23, 2024·0 cites·20 claims
- 0671US11380701B2Memory device and forming method thereofYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jul 5, 2022·0 cites·20 claims
- 0771US11271004B2Memory device and forming method thereofYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Mar 8, 2022·0 cites·19 claims
- 0870US11211393B2Memory device and forming method thereofYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Dec 28, 2021·0 cites·19 claims
- 0969US10529732B2Method for forming staircase structure of three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Jan 7, 2020·1 cites·15 claims
- 1068US10651193B2Memory device and forming method thereofYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted May 12, 2020·1 cites·22 claims
- 1166US2025384901A1Semiconductor device, method of manufacturing thereof and memory systemYANGTZE MEMORY TECH CO LTD·Filed 2025·Application pending·0 cites
- 1266US2025386508A1Semiconductor device, fabrication method thereof, and memory systemYANGTZE MEMORY TECH CO LTD·Filed 2025·Application pending·0 cites
- 1365US2025386505A1Semiconductor device and method for manufacturing the sameYANGTZE MEMORY TECH CO LTD·Filed 2025·Application pending·0 cites
- 1463US11450770B2Structures and methods for reducing stress in three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Sep 20, 2022·0 cites·20 claims
- 1562US2025386507A1Semiconductor structures and manufacturing methods thereof, memoary systems, and electronic devicesYANGTZE MEMORY TECH CO LTD·Filed 2025·Application pending·0 cites
- 1661US2025386504A1Semiconductor device, manufacturing method thereof, memory system and electronicsYANGTZE MEMORY TECH CO LTD·Filed 2025·Application pending·0 cites
- 1759US10930662B2Method for forming staircase structure of three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Feb 23, 2021·0 cites·15 claims
- 1857US2024407169A1Semiconductor devices and manufacturing methods thereof and memory systemsYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 1954US2025386506A1Semiconductor device, manufacturing method thereof and memory systemYANGTZE MEMORY TECH CO LTD·Filed 2025·Application pending·0 cites
- 2052US2024172446A1Semiconductor device and manufacturing method thereof, memory and memory systemYANGTZE MEMORY TECH CO LTD·Filed 2022·Application pending·0 cites
- 2148US2025324592A1Managing three-dimensional semiconductor devicesYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →