Inventor · disambiguated record
Simon Muff
Also filed as: MUFF SIMON
20 granted patents·11 pending applications·342 citations·filing 1998–2007
94Inventor score
Top patents by PatentIndex Score
31 records- 0196US7414917B2Re-driving CAwD and rD signal linesINFINEON TECHNOLOGIES·Filed 2005·Granted Aug 19, 2008·76 cites·9 claims
- 0296US7351072B2Memory module, memory extension memory module, memory module system, and method for manufacturing a memory moduleQIMONDA AG·Filed 2006·Granted Apr 1, 2008·59 cites·31 claims
- 0394US6958613B2Method for calibrating semiconductor devices using a common calibration reference and a calibration circuitINFINEON TECHNOLOGIES AG·Filed 2003·Granted Oct 25, 2005·82 cites·14 claims
- 0487US6434035B2Memory systemINFINEON TECHNOLOGIES AG·Filed 2001·Granted Aug 13, 2002·47 cites·13 claims
- 0586US8199521B2Memory module and method for operating a memory moduleMUFF SIMON·Filed 2007·Granted Jun 12, 2012·13 cites·14 claims
- 0683US7365438B2Semiconductor device with semiconductor components connected to one anotherINFINEON TECHNOLOGIES AG·Filed 2005·Granted Apr 29, 2008·11 cites·10 claims
- 0778US7375971B2Memory module with an electronic printed circuit board and a plurality of semiconductor chips of the same typeINFINEON TECHNOLOGIES AG·Filed 2006·Granted May 20, 2008·9 cites·29 claims
- 0876US7855463B2Method for producing a circuit module comprising at least one integrated circuitQIMONDA AG·Filed 2007·Granted Dec 21, 2010·7 cites·26 claims
- 0967US6534345B1Method for mounting a semiconductor chip on a carrier layer and device for carrying out the methodINFINEON TECHNOLOGIES AG·Filed 2000·Granted Mar 18, 2003·15 cites·5 claims
- 1059US7208827B2Encasing arrangement for a semiconductor componentINFINEON TECHNOLOGIES AG·Filed 2000·Granted Apr 24, 2007·10 cites·11 claims
- 1151US6686764B2Apparatus and method for reducing reflexions in a memory bus systemINFINEON TECHNOLOGIES AG·Filed 2002·Granted Feb 3, 2004·2 cites·24 claims
- 1245US6911732B2Integrated circuitINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jun 28, 2005·1 cites·21 claims
- 1344US6894525B2Method and device for time measurement on semiconductor modules employing the ball-grid-array techniqueINFINEON TECHNOLOGIES AG·Filed 2004·Granted May 17, 2005·3 cites·17 claims
- 1443US8183676B2Memory circuit having memory chips parallel connected to ports and corresponding production methodMUFF SIMON·Filed 2007·Granted May 22, 2012·0 cites·31 claims
- 1541US2008225503A1Electronic system with integrated circuit device and passive componentQIMONDA AG·Filed 2007·Application pending·0 cites
- 1640US6783372B2Apparatus for connecting semiconductor modulesINFINEON TECHNOLOGIES AG·Filed 2003·Granted Aug 31, 2004·0 cites·23 claims
- 1740US2008032446A1combination heat dissipation device with termination and a method of making the sameWOOD STEVE·Filed 2006·Application pending·0 cites
- 1840US2008112142A1Memory module comprising memory devicesRAGHURAM SIVA·Filed 2006·Application pending·0 cites
- 1939US2004201405A1Topology for providing clock signals to multiple circuit units on a circuit moduleFiled 2004·Application pending·0 cites
- 2039US2003006064A1Circuit board for memory componentsINFINEON TECHNOLOGIES AG·Filed 2002·Application pending·0 cites
- 2138US6104615ASemiconductor component assemblySIEMENS AG·Filed 1998·Granted Aug 15, 2000·7 cites·5 claims
- 2238US2002196612A1Arrangement of memory chip housings on a DIMM circuit boardFiled 2002·Application pending·0 cites
- 2338US2004159938A1Semiconductor component and method for producing sameINFINEON TECHNOLOGIES AG·Filed 2003·Application pending·0 cites
- 2435US6968481B2Method and device for adapting/tuning signal transit times on line systems or networks between integrated circuitsINFINEON TECHNOLOGIES AG·Filed 2001·Granted Nov 22, 2005·0 cites·20 claims
- 2535US2007195505A1Memory module deviceSAVIGNAC DOMINIQUE·Filed 2006·Application pending·0 cites
- 2635US2002060372A1IC chipFiled 2001·Application pending·0 cites
- 2734US7474552B2Integrated semiconductor memory deviceINFINEON TECHNOLOGIES AG·Filed 2006·Granted Jan 6, 2009·0 cites·18 claims
- 2833US6765302B2Semiconductor module having a configurable data width of an output bus, and a housing configuration having a semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jul 20, 2004·0 cites·12 claims
- 2931US2006248260A1Circuit systemKUZMENKA MAKSIM·Filed 2006·Application pending·0 cites
- 3029US2006255459A1Stacked semiconductor memory deviceMUFF SIMON·Filed 2005·Application pending·0 cites
- 3128US6798045B2Lead frame, circuit board with lead frame, and method for producing the lead frameINFINEON TECHNOLOGIES AG·Filed 2001·Granted Sep 28, 2004·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →