Inventor · disambiguated record
Sion Quinlan
Also filed as: QUINLAN SION · QUINLAN SION C · QUINLAN SION CHRISTOPHER
22 granted patents·165 citations·filing 1997–2019
95Inventor score
Top patents by PatentIndex Score
22 records- 0195US9739939B1Apparatuses and methods for photonic communication and photonic addressingMICRON TECHNOLOGY INC·Filed 2016·Granted Aug 22, 2017·12 cites·20 claims
- 0290US7119321B2Optical channels for multi-level metal optical imagersMICRON TECHNOLOGY INC·Filed 2003·Granted Oct 10, 2006·47 cites·37 claims
- 0389US7024601B2DVI link with circuit and method for testMICRON TECHNOLOGY INC·Filed 2002·Granted Apr 4, 2006·35 cites·22 claims
- 0481US6922341B2Semiconductor package assembly and method for electrically isolating modulesMICRON TECHNOLOGY INC·Filed 2003·Granted Jul 26, 2005·17 cites·78 claims
- 0575US7836363B2DVI link with circuit and method for testMICRON TECHNOLOGY INC·Filed 2006·Granted Nov 16, 2010·5 cites·26 claims
- 0672US9885827B2Apparatuses and methods for photonic communication and photonic addressingMICRON TECHNOLOGY INC·Filed 2017·Granted Feb 6, 2018·1 cites·18 claims
- 0769US7166918B2Semiconductor package assembly and method for electrically isolating modulesMICRON TECHNOLOGY INC·Filed 2005·Granted Jan 23, 2007·2 cites·16 claims
- 0869US7091584B2Semiconductor package assembly and method for electrically isolating modulesMICRON TECHNOLOGY INC·Filed 2005·Granted Aug 15, 2006·2 cites·20 claims
- 0968US6851183B2Semiconductor package assembly and method for electrically isolating modulesMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 8, 2005·8 cites·4 claims
- 1064US7256068B2Semiconductor package assembly and method for electrically isolating modulesMICRON TECHNOLOGY INC·Filed 2005·Granted Aug 14, 2007·1 cites·5 claims
- 1160US11150405B2Apparatuses and methods for photonic communication and photonic addressingMICRON TECHNOLOGY INC·Filed 2019·Granted Oct 19, 2021·0 cites·15 claims
- 1257US10274675B2Apparatuses and methods for photonic communication and photonic addressingMICRON TECHNOLOGY INC·Filed 2017·Granted Apr 30, 2019·0 cites·20 claims
- 1354US7368701B2Optical channels for multi-level metal optical imagers and method for manufacturing sameMICRON TECHNOLOGY INC·Filed 2005·Granted May 6, 2008·0 cites·17 claims
- 1452US7879649B2Programmable capacitor associated with an input/output padMICRON TECHNOLOGY INC·Filed 2009·Granted Feb 1, 2011·0 cites·25 claims
- 1550US7432593B2Semiconductor package assembly and method for electrically isolating modulesMICRON TECHNOLOGY INC·Filed 2005·Granted Oct 7, 2008·0 cites·16 claims
- 1650US7414299B2Semiconductor package assembly and method for electrically isolating modulesMICRON TECHNOLOGY INC·Filed 2005·Granted Aug 19, 2008·0 cites·25 claims
- 1750US7176566B2Semiconductor package assembly and method for electrically isolating modulesMICRON TECHNOLOGY INC·Filed 2005·Granted Feb 13, 2007·0 cites·12 claims
- 1849US6028467ADifferential output circuitLSI LOGIC CORP·Filed 1997·Granted Feb 22, 2000·26 cites·10 claims
- 1947US8373249B2Programmable capacitor associated with an input/output padMICRON TECHNOLOGY INC·Filed 2011·Granted Feb 12, 2013·0 cites·25 claims
- 2044US7602039B2Programmable capacitor associated with an input/output padMICRON TECHNOLOGY INC·Filed 2002·Granted Oct 13, 2009·2 cites·15 claims
- 2142US7221040B2Semiconductor package assembly and method for electrically isolating modulesMICRON TECHNOLOGY INC·Filed 2003·Granted May 22, 2007·0 cites·17 claims
- 2240US6885324B1Method and apparatus for testing or calibrating an analog to digital converter using a phase locked loopLSI LOGIC CORP·Filed 1999·Granted Apr 26, 2005·7 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →