Inventor · disambiguated record
Siuli Sarkar
Also filed as: SARKAR SIULI
30 granted patents·24 pending applications·45 citations·filing 2006–2025
94Inventor score
Files withALPHA ASSEMBLY SOLUTIONS INC41ALPHA METALS9DE AVILA RIBAS MORGANA1FRY METALS INC1PANDHER RANJIT1
Top patents by PatentIndex Score
54 records- 0189US7968008B2Particles and inks and films using themFRY METALS INC·Filed 2006·Granted Jun 28, 2011·16 cites·14 claims
- 0288US11162007B2Sintering pasteALPHA ASSEMBLY SOLUTIONS INC·Filed 2019·Granted Nov 2, 2021·3 cites·20 claims
- 0385US10259980B2Sintering powderALPHA ASSEMBLY SOLUTIONS INC·Filed 2013·Granted Apr 16, 2019·5 cites·8 claims
- 0482US10130995B2Method for manufacturing metal powderALPHA ASSEMBLY SOLUTIONS INC·Filed 2015·Granted Nov 20, 2018·2 cites·12 claims
- 0582US2024351882A1Production of GrapheneALPHA ASSEMBLY SOLUTIONS INC·Filed 2024·Application pending·0 cites
- 0681US12113039B2Low pressure sintering powderALPHA ASSEMBLY SOLUTIONS INC·Filed 2021·Granted Oct 8, 2024·1 cites·29 claims
- 0780US12278022B2Stretchable interconnects for flexible electronic surfacesALPHA ASSEMBLY SOLUTIONS INC·Filed 2023·Granted Apr 15, 2025·0 cites·16 claims
- 0880US2025375841A1High impact solder toughness alloyALPHA ASSEMBLY SOLUTIONS INC·Filed 2025·Application pending·0 cites
- 0979US11830640B2Stretchable interconnects for flexible electronic surfacesALPHA ASSEMBLY SOLUTIONS INC·Filed 2021·Granted Nov 28, 2023·0 cites·22 claims
- 1079US9217088B2Particles and inks and films using themPARASHAR SACHIN·Filed 2011·Granted Dec 22, 2015·3 cites·16 claims
- 1177US10998284B2Low pressure sintering powderALPHA ASSEMBLY SOLUTIONS INC·Filed 2015·Granted May 4, 2021·3 cites·36 claims
- 1277US2023330788A1Lead-free and antimony-free tin solder reliable at high temperaturesALPHA ASSEMBLY SOLUTIONS INC·Filed 2023·Application pending·0 cites
- 1376US11193031B2Dielectric ink compositionALPHA ASSEMBLY SOLUTIONS INC·Filed 2018·Granted Dec 7, 2021·2 cites·20 claims
- 1475US12497532B2Graphene enhanced and engineered materials for membrane touch switch and other flexible electronic structuresALPHA ASSEMBLY SOLUTIONS INC·Filed 2023·Granted Dec 16, 2025·0 cites·18 claims
- 1575US10322471B2Low temperature high reliability alloy for solder hierarchyALPHA ASSEMBLY SOLUTIONS INC·Filed 2015·Granted Jun 18, 2019·3 cites·21 claims
- 1675US2024413117A1Low pressure sintering powderALPHA ASSEMBLY SOLUTIONS INC·Filed 2024·Application pending·0 cites
- 1774US12084583B2Dielectric ink compositionALPHA ASSEMBLY SOLUTIONS INC·Filed 2021·Granted Sep 10, 2024·0 cites·22 claims
- 1873US11139089B2Stretchable interconnects for flexible electronic surfacesALPHA ASSEMBLY SOLUTIONS INC·Filed 2020·Granted Oct 5, 2021·0 cites·23 claims
- 1973US2025153280A1Low temperature soldering solutions for polymer substrates, printed circuit boards and other joining applicationsALPHA ASSEMBLY SOLUTIONS INC·Filed 2025·Application pending·0 cites
- 2071US10821557B2High reliability lead-free solder alloyALPHA ASSEMBLY SOLUTIONS INC·Filed 2017·Granted Nov 3, 2020·1 cites·23 claims
- 2170US12115602B2Lead-free solder compositionsALPHA ASSEMBLY SOLUTIONS INC·Filed 2019·Granted Oct 15, 2024·0 cites·9 claims
- 2269US2019262951A1High impact solder toughness alloyALPHA ASSEMBLY SOLUTIONS INC·Filed 2019·Application pending·0 cites
- 2369US2019255662A1High impact solder toughness alloyALPHA ASSEMBLY SOLUTIONS INC·Filed 2019·Application pending·0 cites
- 2468US2017304955A1High Impact Solder Toughness AlloyALPHA ASSEMBLY SOLUTIONS INC·Filed 2017·Application pending·0 cites
- 2567US12233483B2Low temperature soldering solutions for polymer substrates, printed circuit boards and other joining applicationsALPHA ASSEMBLY SOLUTIONS INC·Filed 2019·Granted Feb 25, 2025·0 cites·23 claims
- 2667US11929341B2Nano copper paste and film for sintered die attach and similar applicationsALPHA ASSEMBLY SOLUTIONS INC·Filed 2019·Granted Mar 12, 2024·1 cites·8 claims
- 2767US9566668B2Flux formulationsALPHA METALS·Filed 2013·Granted Feb 14, 2017·1 cites·14 claims
- 2867US2024282742A1Nano copper paste and film for sintered die attach and similar applicationsALPHA ASSEMBLY SOLUTIONS INC·Filed 2024·Application pending·0 cites
- 2966US2018290244A1High Impact Solder Toughness AlloyALPHA METALS·Filed 2018·Application pending·0 cites
- 3065US9802275B2Rosin-free thermosetting flux formulationsALPHA ASSEMBLY SOLUTIONS INC·Filed 2014·Granted Oct 31, 2017·2 cites·28 claims
- 3164US2025063830A1Method of manufacturing a solar moduleALPHA ASSEMBLY SOLUTIONS INC·Filed 2022·Application pending·0 cites
- 3263US9751159B2Flux formulationsALPHA ASSEMBLY SOLUTIONS INC·Filed 2016·Granted Sep 5, 2017·0 cites·17 claims
- 3362US10894302B2Multilayered metal nano and micron particlesALPHA ASSEMBLY SOLUTIONS INC·Filed 2015·Granted Jan 19, 2021·1 cites·15 claims
- 3462US2017136583A1High Impact Solder Toughness AlloyALPHA METALS·Filed 2017·Application pending·0 cites
- 3561US10672531B2Stretchable interconnects for flexible electronic surfacesALPHA ASSEMBLY SOLUTIONS INC·Filed 2015·Granted Jun 2, 2020·0 cites·15 claims
- 3659US2016214213A1High impact solder toughness alloyALPHA METALS·Filed 2015·Application pending·0 cites
- 3759US2016144462A1High impact solder toughness alloyALPHA METALS·Filed 2015·Application pending·0 cites
- 3857US11389865B2Sintering materials and attachment methods using sameALPHA ASSEMBLY SOLUTIONS INC·Filed 2015·Granted Jul 19, 2022·1 cites·23 claims
- 3957US2021205935A1Multilayered metal nano and micron particlesALPHA ASSEMBLY SOLUTIONS INC·Filed 2021·Application pending·0 cites
- 4057US2015266137A1Lead-free and antimony-free tin solder reliable at high temperaturesALPHA METALS·Filed 2013·Application pending·0 cites
- 4157US2018072573A1Production of GrapheneALPHA METALS·Filed 2016·Application pending·0 cites
- 4254US11411150B2Advanced solder alloys for electronic interconnectsALPHA ASSEMBLY SOLUTIONS INC·Filed 2019·Granted Aug 9, 2022·0 cites·13 claims
- 4353US11090768B2Lead-free and antimony-free tin solder reliable at high temperaturesALPHA ASSEMBLY SOLUTIONS INC·Filed 2015·Granted Aug 17, 2021·0 cites·16 claims
- 4453US2016023309A1Lead-free and antimony-free tin solder reliable at high temperaturesALPHA METALS·Filed 2015·Application pending·0 cites
- 4550US11624000B2Graphene enhanced and engineered materials for membrane touch switch and other flexible electronic structuresALPHA ASSEMBLY SOLUTIONS INC·Filed 2018·Granted Apr 11, 2023·0 cites·15 claims
- 4650US2014219711A1High impact toughness solder alloyPANDHER RANJIT·Filed 2012·Application pending·0 cites
- 4748US10494696B2Metal recoveryALPHA ASSEMBLY SOLUTIONS INC·Filed 2014·Granted Dec 3, 2019·0 cites·17 claims
- 4845US2022216357A1Solder paste for module fabrication of solar cellsALPHA ASSEMBLY SOLUTIONS INC·Filed 2020·Application pending·0 cites
- 4943US2018102464A1Advanced Solder Alloys For Electronic InterconnectsALPHA ASSEMBLY SOLUTIONS INC·Filed 2016·Application pending·0 cites
- 5042US9786629B2Dual-side reinforcement flux for encapsulationALPHA ASSEMBLY SOLUTIONS INC·Filed 2014·Granted Oct 10, 2017·0 cites·9 claims
Showing the top 50 of 54 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →