Inventor · disambiguated record
Siew Ching Seah
Also filed as: SEAH SIEW CHING
1 granted patent·1 pending application·0 citations·filing 2019–2025
6Inventor score
Technology areasH10W
Files withINFINEON TECHNOLOGIES AG2
Top patents by PatentIndex Score
2 records- 0142US2025309065A1Die attach structure, semiconductor package, method of forming a die attach structure, method of forming a semiconductor package, metal layer stack and method of forming a metal layer stackINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 0236US10914018B2Porous Cu on Cu surface for semiconductor packagesINFINEON TECHNOLOGIES AG·Filed 2019·Granted Feb 9, 2021·0 cites·28 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →