Inventor · disambiguated record
Siow Chek Tan
Also filed as: TAN SIOW CHEK
5 granted patents·15 citations·filing 2014–2019
70Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0191US11043484B1Method and apparatus of package enabled ESD protectionXILINX INC·Filed 2019·Granted Jun 22, 2021·8 cites·20 claims
- 0284US10057976B1Power-ground co-reference transceiver structure to deliver ultra-low crosstalkXILINX INC·Filed 2017·Granted Aug 21, 2018·7 cites·20 claims
- 0344US10770364B2Chip scale package (CSP) including shim dieXILINX INC·Filed 2018·Granted Sep 8, 2020·0 cites·20 claims
- 0440US10314163B2Low crosstalk vertical connection interfaceXILINX INC·Filed 2017·Granted Jun 4, 2019·0 cites·20 claims
- 0533US9780040B1Integrated circuit package substrates having a common die dependent region and methods for designing the sameALTERA CORP·Filed 2014·Granted Oct 3, 2017·0 cites·15 claims
Join the waitlist — get patent alerts
Get an alert when Siow Chek Tan files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →