Inventor · disambiguated record
Si Hao Vincent Yeo
Also filed as: VINCENT YEO SI HAO
3 granted patents·4 citations·filing 2017–2020
56Inventor score
Technology areasH10W
Files withINFINEON TECHNOLOGIES AG3
Top patents by PatentIndex Score
3 records- 0176US10741466B2Formation of conductive connection tracks in package mold body using electroless platingINFINEON TECHNOLOGIES AG·Filed 2017·Granted Aug 11, 2020·3 cites·7 claims
- 0275US11296000B2Formation of conductive connection tracks in package mold body using electroless platingINFINEON TECHNOLOGIES AG·Filed 2020·Granted Apr 5, 2022·1 cites·7 claims
- 0342US10937744B2Semiconductor packages including roughening featuresINFINEON TECHNOLOGIES AG·Filed 2019·Granted Mar 2, 2021·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →