Inventor · disambiguated record
Siwoong Woo
Also filed as: WOO SIWOONG
1 granted patent·4 pending applications·2 citations·filing 2020–2023
18Inventor score
Files withSAMSUNG ELECTRONICS CO LTD5
Top patents by PatentIndex Score
5 records- 0181US12027401B2Semiconductor substrate alignment device and a semiconductor substrate bonding system using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 2, 2024·2 cites·20 claims
- 0246US2024234215A9Apparatus for measuring an adhesion forceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0346US2024153906A1Substrate bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0445US2024038536A1Plasma processing apparatus, wafer to wafer bonding system and wafer to wafer bonding methodSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0536US2021143030A1Wafer to wafer bonding apparatus, wafer to wafer bonding system, and wafer to wafer bonding methodSAMSUNG ELECTRONICS CO LTD·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →