Inventor · disambiguated record
Sijoong Yang
Also filed as: YANG SIJOONG
0 granted patents·3 pending applications·0 citations·filing 2011–2024
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0157US2025022779A1Semiconductor packageSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 0257US2025029904A1Semiconductor frame and semiconductor package including the sameSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 0336US2011290860A1Wire bonding apparatus and method thereofYANG SIJOONG·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →