Inventor · disambiguated record
Si Joong Yang
Also filed as: YANG SI JOONG · YANG SI-YOUNG
8 granted patents·10 pending applications·134 citations·filing 2001–2019
86Inventor score
Top patents by PatentIndex Score
18 records- 0189USD719113SSemiconductor deviceSAMSUNG ELECTRO MECH·Filed 2013·Granted Dec 9, 2014·43 cites·1 claims
- 0289US7696004B2Wafer level package fabrication methodSAMSUNG ELECTRO MECH·Filed 2008·Granted Apr 13, 2010·23 cites·24 claims
- 0385USD719926SSemiconductor deviceSAMSUNG ELECTRO MECH·Filed 2013·Granted Dec 23, 2014·33 cites·1 claims
- 0483USD703625SPower semiconductor moduleSAMSUNG ELECTRO MECH·Filed 2013·Granted Apr 29, 2014·29 cites·1 claims
- 0577US9455207B2All-in-one power semiconductor moduleSAMSUNG ELECTRO MECH·Filed 2013·Granted Sep 27, 2016·4 cites·9 claims
- 0660US7670878B2Method for manufacturing semiconductor packageSAMSUNG ELECTRO MECH·Filed 2008·Granted Mar 2, 2010·2 cites·10 claims
- 0749US2020395396A1Image sensor packageSAMSUNG ELECTRO MECH·Filed 2019·Application pending·0 cites
- 0848US11387270B2Image sensor package including reflectorSAMSUNG ELECTRO MECH·Filed 2019·Granted Jul 12, 2022·0 cites·22 claims
- 0947US2009085134A1Wafer-level image sensor module, method of manufacturing the same, and camera moduleSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1045US2009085204A1Wafer-level package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1144US2015091146A1Power semiconductor packageSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1243US9123688B2Semiconductor module packageSAMSUNG ELECTRO MECH·Filed 2013·Granted Sep 1, 2015·0 cites·7 claims
- 1343US2011012220A1Wafer-level image sensor module, method of manufacturing the same and camera moduleSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 1442US2014110833A1Power module packageSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1541US2014035157A1Semiconductor package, manufacturing method thereof, and semiconductor package manufacturing moldSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 1639US2014029201A1Power package module and manufacturing method thereofYANG SI JOONG·Filed 2012·Application pending·0 cites
- 1733US2012125096A1Inertial sensorPARK HEUNG WOO·Filed 2011·Application pending·0 cites
- 1829US2002109970A1Heat sink for cooling electronic chipSAMSUNG ELECTRO MECH·Filed 2001·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Si Joong Yang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →