Inventor · disambiguated record
Sopa Chevacharoenkul
Also filed as: CHEVACHAROENKUL SOPA
11 granted patents·4 pending applications·8 citations·filing 2006–2024
82Inventor score
Top patents by PatentIndex Score
15 records- 0179US2025020740A1Layouts for interlevel crack prevention in fluxgate technology manufacturingTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0271US9771261B1Selective patterning of an integrated fluxgate deviceTEXAS INSTRUMENTS INC·Filed 2016·Granted Sep 26, 2017·1 cites·17 claims
- 0370US11508721B2Integrated fluxgate deviceTEXAS INSTRUMENTS INC·Filed 2021·Granted Nov 22, 2022·0 cites·5 claims
- 0464US12105161B2Layouts for interlevel crack prevention in fluxgate technology manufacturingTEXAS INSTRUMENTS INC·Filed 2019·Granted Oct 1, 2024·0 cites·14 claims
- 0564US9691751B2In-situ doped polysilicon filler for trenchesTEXAS INSTRUMENTS INC·Filed 2014·Granted Jun 27, 2017·2 cites·14 claims
- 0661US8334190B2Single step CMP for polishing three or more layer film stacksDAVIS EUGENE C·Filed 2010·Granted Dec 18, 2012·2 cites·16 claims
- 0758US10005662B2Selective patterning of titanium encapsulation layersTEXAS INSTRUMENTS INC·Filed 2017·Granted Jun 26, 2018·0 cites·27 claims
- 0858US7727885B2Reduction of punch-thru defects in damascene processingTEXAS INSTRUMENTS INC·Filed 2006·Granted Jun 1, 2010·1 cites·23 claims
- 0955US10978448B2Integrated fluxgate deviceTEXAS INSTRUMENTS INC·Filed 2016·Granted Apr 13, 2021·0 cites·15 claims
- 1055US7745335B2Semiconductor device manufactured by reducing hillock formation in metal interconnectsTEXAS INSTRUMENTS INC·Filed 2006·Granted Jun 29, 2010·1 cites·10 claims
- 1155US2017234942A1Layouts for interlevel crack prevention in fluxgate technology manufacturingTEXAS INSTRUMENTS INC·Filed 2016·Application pending·0 cites
- 1249US8110414B2Forming integrated circuit devices with metal-insulator-metal capacitors using selective etch of top electrodesCATHEY JR MARSHALL O·Filed 2009·Granted Feb 7, 2012·1 cites·3 claims
- 1345US2010120242A1Method to prevent localized electrical open cu leads in vlsi cu interconnectsTEXAS INSTRUMENTS INC·Filed 2008·Application pending·0 cites
- 1441US11121207B2Integrated trench capacitor with top plate having reduced voidsTEXAS INSTRUMENTS INC·Filed 2016·Granted Sep 14, 2021·0 cites·20 claims
- 1532US2017221983A1In-situ doped then undoped polysilicon filler for trenchesTEXAS INSTRUMENTS INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →