Inventor · disambiguated record

Soonseong Choi

Also filed as: CHOI SOONSEONG

1 granted patent·0 citations·filing 2019–2019

4Inventor score

Technology areasH10W

Files withJMJ KOREA CO LTD1

Top patents by PatentIndex Score

1 record

0135US10714450B2Method of bonding terminal of semiconductor chip using solder bump and semiconductor package using the sameJMJ KOREA CO LTD·Filed 2019·Granted Jul 14, 2020·0 cites·3 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →