Inventor · disambiguated record
Sorin Dinescu
Also filed as: DINESCU SORIN
3 granted patents·2 pending applications·15 citations·filing 2013–2024
62Inventor score
Top patents by PatentIndex Score
5 records- 0191US12085609B1Thermal control wafer with integrated heating-sensing elementsAEM SINGAPORE PTE LTD·Filed 2023·Granted Sep 10, 2024·1 cites·28 claims
- 0290US12013432B1Thermal control wafer with integrated heating-sensing elementsAEM SINGAPORE PTE LTD·Filed 2023·Granted Jun 18, 2024·1 cites·29 claims
- 0381US9340462B2Transient liquid phase, pressureless joining of aluminum nitride componentsHARRIS JONATHAN H·Filed 2013·Granted May 17, 2016·13 cites·11 claims
- 0479US2025067797A1Thermal control wafer with integrated heating-sensing elementsAEM SINGAPORE PTE LTD·Filed 2024·Application pending·0 cites
- 0543US2016150594A1Thermocompression bonding apparatus and methodNOOTENS STEPHEN P·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →