Inventor · disambiguated record

Soon Wee David Ho

Also filed as: HO SOON WEE · HO SOON WEE DAVID

0 granted patents·2 pending applications·0 citations·filing 2008–2012

Technology areasH10P H10W

Files withAGENCY SCIENCE TECH & RES1 KRIPESH VAIDYANATHAN1

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2 records

0152US2011316117A1Die package and a method for manufacturing the die packageKRIPESH VAIDYANATHAN·Filed 2008·Application pending·0 cites
0234US2013001795A1Wafer Level Package and a Method of Forming the SameAGENCY SCIENCE TECH & RES·Filed 2012·Application pending·0 cites

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