Inventor · disambiguated record
Songwon Hyun
Also filed as: HYUN SONGWON
2 granted patents·0 citations·filing 2020–2021
24Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD2
Top patents by PatentIndex Score
2 records- 0154US11827741B2Epoxy compound, composition prepared therefrom, semiconductor device prepared therefrom, electronic device prepared therefrom, article prepared therefrom, and method of preparing epoxy compoundSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 28, 2023·0 cites·16 claims
- 0243US11926695B2High-thermal conductive epoxy compound and composition, material for semiconductor package, molded product, electric and electronic device, and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Mar 12, 2024·0 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →