Inventor · disambiguated record
Soungsoo Kim
Also filed as: KIM SOUNGSOO
5 granted patents·7 citations·filing 2005–2024
68Inventor score
Top patents by PatentIndex Score
5 records- 0178US8784634B2Electrolytic method for filling holes and cavities with metalsREENTS BERT·Filed 2007·Granted Jul 22, 2014·5 cites·25 claims
- 0276US12439528B2Method of preparing a high density interconnect printed circuit board including microvias filled with copperATOTECH DEUTSCHLAND GMBH & CO KG·Filed 2024·Granted Oct 7, 2025·0 cites·13 claims
- 0372US9445510B2Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copperREENTS BERT·Filed 2005·Granted Sep 13, 2016·2 cites·22 claims
- 0459US12245383B2Method of preparing a high density interconnect printed circuit board including microvias filled with copperATOTECH DEUTSCHLAND GMBH & CO KG·Filed 2020·Granted Mar 4, 2025·0 cites·12 claims
- 0547US9526183B2Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copperATOTECH DEUTSCHLAND GMBH·Filed 2016·Granted Dec 20, 2016·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →