Inventor · disambiguated record
Soon-Bum Kim
Also filed as: KIM SOON BUM
9 granted patents·4 pending applications·552 citations·filing 2004–2018
90Inventor score
Top patents by PatentIndex Score
13 records- 0197US7151009B2Method for manufacturing wafer level chip stack packageSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Dec 19, 2006·356 cites·20 claims
- 0295US7015590B2Reinforced solder bump structure and method for forming a reinforced solder bumpSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Mar 21, 2006·119 cites·18 claims
- 0392US7271084B2Reinforced solder bump structure and method for forming a reinforced solder bumpSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Sep 18, 2007·26 cites·42 claims
- 0488US7307342B2Interconnection structure of integrated circuit chipSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Dec 11, 2007·16 cites·19 claims
- 0579US9646945B2Semiconductor device having solder joint and method of forming the sameKIM SOON-BUM·Filed 2015·Granted May 9, 2017·5 cites·20 claims
- 0676US7855144B2Method of forming metal lines and bumps for semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Dec 21, 2010·7 cites·15 claims
- 0774US7214604B2Method of fabricating ultra thin flip-chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted May 8, 2007·17 cites·14 claims
- 0867US7524763B2Fabrication method of wafer level chip scale packagesSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Apr 28, 2009·4 cites·12 claims
- 0964US7732319B2Interconnection structure of integrated circuit chipSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jun 8, 2010·2 cites·16 claims
- 1048US2007200251A1Method of fabricating ultra thin flip-chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 1147US2007200216A1Chip stack packageSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 1241US2005104222A1Flip chip device having supportable bar and mounting structure thereofFiled 2004·Application pending·0 cites
- 1341US2019181067A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →