Inventor · disambiguated record
Soichiro Kishimoto
Also filed as: KISHIMOTO SOICHIRO
16 granted patents·232 citations·filing 1974–2005
94Inventor score
Top patents by PatentIndex Score
16 records- 0187US6653736B2Multilayer flexible wiring boardsSONY CHEMICALS CORP·Filed 2002·Granted Nov 25, 2003·36 cites·12 claims
- 0287US4001382AProcess for producing carbon fibers having excellent physical propertiesJAPAN EXLAN CO LTD·Filed 1975·Granted Jan 4, 1977·29 cites·10 claims
- 0386US6570098B2Printed wiring board and method for producing the sameSONY CORP·Filed 2001·Granted May 27, 2003·32 cites·2 claims
- 0482US4009248AProcess for producing carbon fibersJAPAN EXLAN CO LTD·Filed 1976·Granted Feb 22, 1977·23 cites·12 claims
- 0579US4024227AProcess for producing carbon fibers having excellent propertiesJAPAN EXLAN CO LTD·Filed 1975·Granted May 17, 1977·20 cites·12 claims
- 0678US6524892B1Method of fabricating multilayer flexible wiring boardsSONY CHEMICALS CORP·Filed 2000·Granted Feb 25, 2003·21 cites·4 claims
- 0775US4080417AProcess for producing carbon fibers having excellent propertiesJAPAN EXLAN CO LTD·Filed 1976·Granted Mar 21, 1978·19 cites·19 claims
- 0872US6941648B2Method for producing printed wiring boardSONY CORP·Filed 2003·Granted Sep 13, 2005·14 cites·25 claims
- 0963US7520053B2Method for manufacturing a bump-attached wiring circuit boardSONY CORP·Filed 2005·Granted Apr 21, 2009·2 cites·8 claims
- 1062US3933986AProcess for producing carbon fibersJAPAN EXLAN CO LTD·Filed 1974·Granted Jan 20, 1976·10 cites·13 claims
- 1159US4154807AProcess for the production of carbon fibersJAPAN EXLAN CO LTD·Filed 1978·Granted May 15, 1979·9 cites·11 claims
- 1255US3993719AProcess for producing carbon fibersJAPAN EXLAN CO LTD·Filed 1975·Granted Nov 23, 1976·7 cites·14 claims
- 1349US6518510B2Bump-attached wiring circuit board and method for manufacturing sameSONY CHEMICALS CORP·Filed 2001·Granted Feb 11, 2003·3 cites·8 claims
- 1444US7020961B2Method for manufacturing a bump-attached wiring circuit boardSONY CORP·Filed 2002·Granted Apr 4, 2006·1 cites·8 claims
- 1542US7285727B2Flexible wiring boards for double-side connectionSONY CHEM & INF DEVICE CORP·Filed 2003·Granted Oct 23, 2007·3 cites·6 claims
- 1640US4009991AProcess for producing carbon fibersJAPAN EXLAN CO LTD·Filed 1975·Granted Mar 1, 1977·3 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →