Inventor · disambiguated record
Souichirou Komiya
Also filed as: KOMIYA SOUICHIROU
3 granted patents·3 pending applications·0 citations·filing 2010–2023
41Inventor score
Files withRESONAC CORP2SHOWA DENKO MATERIALS CO LTD2HITACHI CHEMICAL CO LTD1HITACHI KASEI POLYMER CO LTD1
Top patents by PatentIndex Score
6 records- 0173US2025277077A1Resin composition, method for producing same, and cured product of resin compositionRESONAC CORP·Filed 2023·Application pending·0 cites
- 0273US2025101181A1Resin composition and production method therefor, and cured product of resin compositionRESONAC CORP·Filed 2023·Application pending·0 cites
- 0355US12043774B2Reactive hot-melt adhesive composition, and bonded body and method for producing sameSHOWA DENKO MATERIALS CO LTD·Filed 2020·Granted Jul 23, 2024·0 cites·11 claims
- 0445US11624016B2Moisture-curable reactive hot-melt adhesive composition and method for producing the sameHITACHI CHEMICAL CO LTD·Filed 2017·Granted Apr 11, 2023·0 cites·19 claims
- 0539US12241000B2Moisture-curable hot-melt adhesive composition, bonded object, and garmentSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Mar 4, 2025·0 cites·12 claims
- 0632US2011021695A1Urethane (meth) acrylate composition and seal memberHITACHI KASEI POLYMER CO LTD·Filed 2010·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Souichirou Komiya files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →