Inventor · disambiguated record
Soyeon Kwon
Also filed as: KWON SOYEON
1 granted patent·6 pending applications·0 citations·filing 2022–2024
1Inventor score
Files withSAMSUNG ELECTRONICS CO LTD7
Top patents by PatentIndex Score
7 records- 0157US2025174573A1Packaged semiconductor chips having protected identification marks thereinSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0256US2025079250A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0353US2024321667A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0453US2024213109A1Semiconductor package with semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0551US2024157481A1Semiconductor chip splitting method using a laser and semiconductor chip split by the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0651US2024387420A1Semiconductor package in a stack formSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0747US12218096B2Semiconductor package and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 4, 2025·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →