Inventor · disambiguated record
Soon Ju Lee
Also filed as: LEE SOON HO · LEE SOON JU
16 granted patents·7 pending applications·51 citations·filing 2002–2025
90Inventor score
Top patents by PatentIndex Score
23 records- 0195US9799453B2Multilayer ceramic capacitor and board having the sameSAMSUNG ELECTRO MECH·Filed 2015·Granted Oct 24, 2017·8 cites·6 claims
- 0294US9288906B2Mounting circuit board of multilayer ceramic capacitorSAMSUNG ELECTRO MECH·Filed 2014·Granted Mar 15, 2016·13 cites·4 claims
- 0389US9697953B2Multilayer ceramic electronic component and board having the sameSAMSUNG ELECTRO MECH·Filed 2015·Granted Jul 4, 2017·5 cites·37 claims
- 0485US9208949B2Multilayer ceramic capacitorSAMSUNG ELECTRO MECH·Filed 2014·Granted Dec 8, 2015·5 cites·13 claims
- 0581US9412520B2Multilayer ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2014·Granted Aug 9, 2016·3 cites·13 claims
- 0680US9480158B2Interposer, electronic component including the same, and board having electronic component including the sameSAMSUNG ELECTRO MECH·Filed 2015·Granted Oct 25, 2016·2 cites·11 claims
- 0780US9326381B2Multilayer ceramic capacitor and board having the same mounted thereonSAMSUNG ELECTRO MECH·Filed 2014·Granted Apr 26, 2016·3 cites·19 claims
- 0880US9024202B2Electronic chip component and board having the same mounted thereonSAMSUNG ELECTRO MECH·Filed 2013·Granted May 5, 2015·4 cites·18 claims
- 0979US9775244B2Multilayer ceramic component having metal frames connected to external electrodes thereof and board having the sameSAMSUNG ELECTRO MECH·Filed 2015·Granted Sep 26, 2017·2 cites·20 claims
- 1079US9646769B2Multilayer ceramic component and board having the sameSAMSUNG ELECTRO MECH·Filed 2015·Granted May 9, 2017·3 cites·13 claims
- 1175US9818541B2Multilayer ceramic electronic component and board having the sameSAMSUNG ELECTRO MECH·Filed 2015·Granted Nov 14, 2017·2 cites·19 claims
- 1270US9520239B2Chip electronic component and board having the sameSAMSUNG ELECTRO MECH·Filed 2015·Granted Dec 13, 2016·1 cites·6 claims
- 1369US2025185241A1Semiconductor device and manufacturing method of semiconductor deviceSK HYNIX INC·Filed 2025·Application pending·0 cites
- 1462US12250811B2Semiconductor device and manufacturing method of semiconductor deviceSK HYNIX INC·Filed 2021·Granted Mar 11, 2025·0 cites·4 claims
- 1560US10319525B2Multi-layer ceramic capacitor assemblySAMSUNG ELECTRO MECH·Filed 2017·Granted Jun 11, 2019·0 cites·2 claims
- 1659US10714265B2Laminated electronic component and circuit board for mounting the sameSAMSUNG ELECTRO MECH·Filed 2019·Granted Jul 14, 2020·0 cites·19 claims
- 1753US2016217929A1Multi-layer ceramic capacitor assemblySAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
- 1851US2017011854A1Laminated electronic component and circuit board for mounting the sameSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
- 1950US2014368967A1Multilayer ceramic capacitor and board having the same mounted thereonSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2045US9520233B2Electronic component and board having the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Dec 13, 2016·0 cites·13 claims
- 2136US2016126013A1Multilayer ceramic electronic component and board having the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 2236US2016120027A1Multilayer ceramic electronic component and board having the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 2333US2003136513A1Semiconductor manufacturing apparatusFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →