Inventor · disambiguated record
Song-Bor Lee
Also filed as: LEE SONG-BOR
24 granted patents·5 pending applications·211 citations·filing 2005–2024
94Inventor score
Top patents by PatentIndex Score
29 records- 0198US7825024B2Method of forming through-silicon viasTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Nov 2, 2010·170 cites·20 claims
- 0297US11233119B2Core-shell nanostructures for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 25, 2022·4 cites·20 claims
- 0394US11233149B2Spacer structures for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 25, 2022·3 cites·19 claims
- 0492US8890293B2Guard ring for through viasLU CHIH-HUNG·Filed 2011·Granted Nov 18, 2014·16 cites·20 claims
- 0591US11929422B2Passivation layers for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 12, 2024·1 cites·20 claims
- 0689US11881530B2Spacer structures for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 23, 2024·1 cites·20 claims
- 0788US11621343B2Method of manufacturing semiconductor devices and semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 4, 2023·1 cites·20 claims
- 0888US11101360B2Method of manufacturing a semiconductor device and a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 24, 2021·4 cites·20 claims
- 0983US2024322011A1Method of manufacturing semiconductor devices and semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1082US12040381B2Method of manufacturing semiconductor devices and semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 16, 2024·0 cites·20 claims
- 1181US12432986B2Spacer structures for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 30, 2025·0 cites·20 claims
- 1280US12426322B2Core-shell nanostructures for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 23, 2025·0 cites·20 claims
- 1380US11695055B2Passivation layers for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 4, 2023·1 cites·20 claims
- 1480US11450567B2Package component with stepped passivation layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 20, 2022·1 cites·20 claims
- 1579US9122828B2Apparatus and method for designing an integrated circuit layout having a plurality of cell technologiesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 1, 2015·5 cites·18 claims
- 1678US11075269B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 27, 2021·2 cites·20 claims
- 1774US11824089B2Core-shell nanostructures for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 21, 2023·0 cites·20 claims
- 1872US2024222194A1Package component with stepped passivation layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1971US11961762B2Package component with stepped passivation layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 16, 2024·0 cites·20 claims
- 2066US11069791B2Method of manufacturing semiconductor devices and semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 20, 2021·0 cites·20 claims
- 2166US9123673B2Wafer back side processing structure and apparatusTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 1, 2015·1 cites·20 claims
- 2264US11990510B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 21, 2024·0 cites·20 claims
- 2360US9009639B2Method and system for enhanced integrated circuit layoutTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Apr 14, 2015·1 cites·20 claims
- 2457US2024282820A1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2553US2023411279A1Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2652US9443721B2Wafer back side processing structure and apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Sep 13, 2016·0 cites·20 claims
- 2746US9406559B2Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 2, 2016·0 cites·20 claims
- 2840US2006178767A1Systems and methods for inspection controlTAIWAN SEMICONDUCTOR MFG·Filed 2005·Application pending·0 cites
- 2936US9666483B2Integrated circuit having thinner gate dielectric and method of makingLU CHIH-HUNG·Filed 2012·Granted May 30, 2017·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →