Inventor · disambiguated record
Soon Lee Liew
Also filed as: LIEW SOON LEE
5 granted patents·1 pending application·2 citations·filing 2018–2024
64Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0175US12451413B2Packaged semiconductor devices with leadframes having tie bar with recessed cavityMACOM TECH SOLUTIONS HOLDINGS INC·Filed 2024·Granted Oct 21, 2025·0 cites·19 claims
- 0268US10777536B2Semiconductor package with air cavityINFINEON TECHNOLOGIES AG·Filed 2018·Granted Sep 15, 2020·2 cites·22 claims
- 0366US12470185B2Semiconductor device packages with exposed heat dissipating surfaces and methods of fabricating the sameWOLFSPEED INC·Filed 2022·Granted Nov 11, 2025·0 cites·31 claims
- 0464US12009286B2Methods of forming packaged semiconductor devices and leadframes for semiconductor device packagesMACOM TECH SOLUTIONS HOLDINGS INC·Filed 2021·Granted Jun 11, 2024·0 cites·15 claims
- 0551US12119239B2Packaged semiconductor devices, and package molds for forming packaged semiconductor devicesWOLFSPEED INC·Filed 2021·Granted Oct 15, 2024·0 cites·12 claims
- 0651US2024105570A1Transistor package and process of implementing the transistor packageWOLFSPEED INC·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →