Inventor · disambiguated record
Soyoung Lim
Also filed as: LIM SOYOUNG
8 granted patents·5 pending applications·16 citations·filing 2010–2025
79Inventor score
Top patents by PatentIndex Score
13 records- 0184US9922891B2Film for semiconductor package, semiconductor package using film and display device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Mar 20, 2018·4 cites·20 claims
- 0283US10304764B2Film product, film packages and package modules using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 28, 2019·5 cites·19 claims
- 0377US8269342B2Semiconductor packages including heat slugsKIM YONGHOON·Filed 2010·Granted Sep 18, 2012·6 cites·17 claims
- 0465US9576865B2Film for semiconductor package, semiconductor package using film and display device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Feb 21, 2017·1 cites·20 claims
- 0561US2025096085A1Chip on film package and display apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0654US2025333005A1Garment hanger apparatuses and method of hanging garmentsGM GLOBAL TECH OPERATIONS LLC·Filed 2024·Application pending·0 cites
- 0753US2024014221A1Semiconductor package and package module including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0850US2025131230A1Fingerprint sensor package carrier and fingerprint sensor package assembly methodSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0949US9313889B2Display apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Apr 12, 2016·0 cites·17 claims
- 1047US11862548B2Package substrate film and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 2, 2024·0 cites·20 claims
- 1141US8828795B2Method of fabricating semiconductor package having substrate with solder ball connectionsJO SANG-GUI·Filed 2012·Granted Sep 9, 2014·0 cites·8 claims
- 1240US2025386653A1Display device including display moduleSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1337US8304892B2Semiconductor package having substrate with solder ball connections and method of fabricating the sameJO SANG-GUI·Filed 2010·Granted Nov 6, 2012·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →