Inventor · disambiguated record
Souichirou Omae
Also filed as: OMAE SOUICHIROU
1 granted patent·1 pending application·0 citations·filing 2020–2021
9Inventor score
Files withSHINRYO CORP2
Top patents by PatentIndex Score
2 records- 0148US12285823B2Low melting-point bonding member, method for producing same, semiconductor electronic circuit, and method for mounting said semiconductor electronic circuitSHINRYO CORP·Filed 2021·Granted Apr 29, 2025·0 cites·9 claims
- 0232US2022395935A1Sn-bi-in-based low melting-point joining member, production method therefor, semiconductor electronic circuit, and mounting method thereforSHINRYO CORP·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →